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# Staff Thermal Engineer, Hardware Design

- **Company:** Celestica (nyse, Tsx: Cls)
- **Location:** Austin, TX, United States
- **Contract:** Permanent contract
- **Skills:** 3D Computer Graphics Software, Hardware Design, Software Requirements Analysis, Test Data, Model Validation
- **Published:** October 2, 2026
- **Apply:** https://www.juju.com/job/1_celestica2-131066

## About the Role

Job duties and the % of time identified for any function are subject to change at any time. **Salary Range:** _The salary range described in this posting is an estimate by the Company, and may change based on several factors, including by not limited to a change in the duties covered by the job posting, or the credentials, experience or geographic jurisdiction of the successful candidate._ _Salary Range: $_ 128K - $200K _Annually_ All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.

## Description

Must have relevant coursework in heat transfer and fluid mechanics, and good familiarity with 3D software applications.
As a member of the Hardware Product Development team, you have the ability to work in partnership with hardware, software, and thermal architects within and outside Celestica to define the best in class products.
Celestica has a profoundly cooperative and nonconfrontational culture. **Responsibilities:** + Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing. + Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs. + Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products. + Conceive and implement ways to enhance and extend operation of heat transfer hardware. + Consider the thermal aspects of chip packaging technologies. + Apply best-in-class fluid flow geometry and technology to cool high heat flux chips. + Determine and consider the effects of contact resistance and the use of Thermal Interface Materials. + Apply air cooling when possible and
liquid cooling when necessary to achieve full performance and reliability at the lowest cost. + Size liquid cold plates, heat sinks, heat pipes, air movers, air filters, air ducting, and perforated plates. + Plan your work to achieve full required performance, and stay on schedule to support overall product development. + Reference real world limitations to inform your work, such as manufacturing methods and cost, reliability, variability of incoming parts, and tolerances on all specifications. + Perform hands-on lab tests of equipment from component to rack and facility level for design and model validation.
Document thermal test plans, devise and build test stands, including technical support, cooling liquid supply, power delivery, metrology and instrumentation, compute workload, experiment control, and data recording. + Analyze test data to draw inferences about the equipment tested.
Apply statistical methods as required to maximize utilization of data and test usefulness. + Work with multi-disciplinary groups to define system requirements and design products. + Work with cross-functional teams to identify root causes of system performance. **Typical Education** Master's degree in Mechanical Engineering.
Preference given to candidates with their Master's concentration in heat transfer and fluid mechanics.
Educational Requirements may vary by Geography **Notes** This job description is not intended to be an exhaustive list of all duties and responsibilities of the position.
Employees are held accountable for all duties of the job.