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# Design Engineer

- **Company:** Pyramid Consulting Inc.
- **Location:** Lansdale, PA, United States
- **Experience:** Expert
- **Salary:** $187,200.0
- **Contract:** Contract
- **Skills:** Adobe InDesign, Altium Designer, Software Debugging, Ethernet, OrCAD, PCI Express, Signal Integrity, Hfss, Mentor Graphics
- **Published:** October 6, 2026
- **Apply:** https://www.dice.com/job-detail/da5d609d-e4c7-4c8d-b0d9-d9e5f7e23b6b

## About the Role

* 8+ years of professional PCB design experience
 * Extensive RF layout experience (GHz-range designs preferred)
 * Strong proficiency in:
 * Altium Designer
 * Siemens Xpedition (Mentor Graphics)
 * Cadence Allegro PCB Designer
 * Experience with high-layer-count boards (10 layers preferred)
 * Deep understanding of:
 * Controlled impedance routing
 * Differential pair routing
 * Crosstalk mitigation
 * Return path management
 * Grounding and shielding strategies
 * Experience working with high-speed interfaces (e.g., SERDES, DDR, PCIe, Ethernet, etc.)
 * Familiarity with stack-up design and material selection for RF performance
 * Working knowledge of SI/PI analysis tools
 * Experience in the defense, aerospace, or military electronics industry
 * Familiarity with MIL-STD requirements and ITAR-controlled environments
 * Experience designing for harsh environments (temperature, vibration, shock)
 * Security clearance (active or eligible)
 * Experience with simulation tools (HFSS, ADS, HyperLynx, etc.)
 * IPC CID/CID certification
 * Work on cutting-edge RF and mission-critical defense technologies
 * Collaborative engineering culture

## Description

Immediate need for a talented Design Engineer. This is a 06+months contract opportunity with long-term potential and is located in Lansdale , PA(Onsite). Please review the job description below and contact me ASAP if you are interested., * Design and develop complex, multi-layer PCBs (including rigid, flex, and rigid-flex) for RF and high-speed digital applications

 * Perform RF layout for controlled impedance structures, transmission lines, antennas, filters, LNAs, and mixed-signal designs
 * Implement best practices for signal integrity (SI), power integrity (PI), EMI/EMC mitigation, and thermal management
 * Collaborate closely with RF, hardware, mechanical, and manufacturing engineers throughout the product lifecycle
 * Create and maintain PCB libraries, stack-up, and design rules
 * Generate fabrication and assembly documentation packages
 * Support prototype bring-up, testing, and debugging activities
 * Ensure compliance with IPC standards (IPC-2221/2222/6012, etc.) and defense-related requirements
 * Interface with PCB fabricators and CM partners to resolve DFM/DFT issues
 * Participate in design reviews and provide technical leadership/mentorship to junior designers