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# Staff Engineer Simulation and Package Design Methodology iv)

- **Company:** Infineon
- **Location:** Villach, Austria
- **Experience:** Experienced
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Bash Shell, Comsol Multiphysics, Linux, Perl (Programming Language), Python (Programming Language), MATLAB, Machine Learning, Package Development Process, Systems Development Life Cycle, Ansys
- **Published:** November 3, 2026
- **Apply:** https://www.karriere.at/jobs/7897795

## About the Role

* Degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering, or a related technical discipline
 * At least 4 years of professional experience in semiconductor package development, simulation, design methodologies, EDA environments, or related engineering fields
 * Strong background in electromagnetic, thermal or multiphysics simulation for semiconductor package and system development
 * Hands-on experience with i ndustry-standard simulation environments such as Synopsys/Ansys, Cadence, Siemens, Keysight, COMSOL, or comparable engineering platforms
 * Proven track record in developing, optimizing, and deploying simulation methodologies, engineering workflows, and design environments
 * Solid knowledge of Linux and one or several of the following programming languages: Python, bash, MATLAB, Perl, skill
 * Strong analytical and problem-solving skills combined with excellent communication abilities and a customer-oriented mindset
 * Experience with development and integration of Machine Learning (ML) and Artificial Intelligence (AI) tools for design or simulation is an advantage
 * Fluent English skills are required; German language skills are considered as an advantage