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# Senior Silicon Architect - Cache Coherent Interconnects

- **Company:** NVIDIA Corporation
- **Location:** Hillsboro, OR, United States
- **Experience:** Expert
- **Salary:** $168,000.0 - $264,500.0
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Computer Engineering, Logic Synthesis of Circuits, Dynamic Random-Access Memory, PCI Express, Systems Architecture, Computer Network Operations, Application Specific Integrated Circuits, Information Technology, Physical Design
- **Published:** November 4, 2026
- **Apply:** https://www.careerbuilder.com/job-details/senior-silicon-architect-cache-coherent-interconnects-hillsboro-or--5d5966e8-6f36-4886-a09c-486890b2939d

## About the Role

Technical/Engineering Design, Logic Design, Floorplanning, Autonomous Driving Systems, Construction, Artificial Intelligence (AI), CPU (Central Processing Unit), Graphics, Construction Planning, Network Operations Center, * Master's Degree in Electrical Engineering, Computer Engineering or Computer Science or equivalent experience.

 * 8+ years of experience in processor or other related high-performance semiconductor designs.
 * Deep understanding of digital design, CPU system architecture and ASIC floor-planning, including wire densities on-die and across 3D connected dies.
 * A strong background in cache coherency or high-speed interconnects and industry-standard coherency/IO/memory protocols is helpful.
 * Knowledge of advanced packaging (TSMC InFO and CoWoS, Intel EMIB), through-silicon via configurations and backside power delivery is preferred, along with Dielet, Interposer, Substrate connectivity.
 * Strong communication and interpersonal skills are required along with the ability to work in a dynamic, global team.

## Description

We are now looking for a Senior Logic Design Engineer!

As a member of our CPU Cache Coherent Interconnects Design Team, you will be responsible for the silicon architecture and construction of our CPU processors, focusing on such tasks as dielet partitioning, packaging and die-stacking exploration, floorplanning and die-to-die interface planning. This position offers you the opportunity to have real impact in a dynamic, technology-focused company impacting product lines ranging from consumer graphics to self-driving cars and the growing field of artificial intelligence! We have crafted a team of extraordinary people stretching around the globe, whose mission is to push the frontiers of what is possible today and define the platform for the future of computing.

What you'll be doing:

 * As a member of our core CPU team, you'll own the silicon architecture and construction plan for next-generation CPU processors.
 * Explore 2D multi-chip module, 2.5D interposer and 3D hybrid-bonded dielet constructions, including the placement of IO and compute (CPU cores, caches and NOC) across dielets.
 * Develop early floorplans, and plan die-to-die and off-chip IO, including UCIe, DRAM and PCIe.
 * Work with architecture, logic design, physical design and packaging teams to achieve your area, performance, power and thermal goals.