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# Internship Hybrid DRAM: Next-Gen ferroelectric memory for energy-constrained systems-Grenoble-H/F

- **Company:** CEA Industrie
- **Location:** Grenoble, France
- **Experience:** Internship
- **Contract:** Internship / Graduate position
- **Skills:** Quantum Computing, Cyber-physical Systems, Signal Processing, High Performance Computing
- **Published:** November 6, 2026
- **Apply:** https://www.emploi.cea.fr/offre-de-emploi/emploi-internship-hybrid-dram-next-gen-ferroelectric-memory-for-energy-constrained-systems-grenoble-h-f_42461.aspx

## About the Role

Desired skills and experience
This internship is intended for students in the final year of a Master's degree or engineering programme, preferably with a background in electronics, microelectronics, or embedded systems.

Solid circuit design skills, particularly in schematic capture and SPICE simulation and language, are desirable, together with a good understanding of memory hierarchies and low-power design principles.

The internship can form the basis of a PhD's thesis. A funded PhD position will subsequently be available, offering an opportunity to continue this research., Diplôme préparé

Bac+5 - Diplôme École d'ingénieurs

Formation recommandée

Master 2 / Ecole d'ingénieurs

Possibilité de poursuite en thèse

## Description

The Laboratory for Innovative Functions for Mixed-Signal Circuits (LFIM) is tasked with the study and design of digital and mixed-signal electronic circuits that meet requirements for energy efficiency, compact size, real-time operation, and operational reliability.
These circuits are applied in a wide range of systems and fields, such as high-performance computing architectures and low-power embedded systems-areas that now converge in the context of quantum computing, where a cryogenic environment imposes conflicting demands regarding performance and power dissipation.

The technologies developed within the laboratory leverage the latest advancements in nanoelectronics. The LFIM studies, designs, and integrates digital and mixed-signal processing architectures onto silicon to address application needs in areas including high-performance computing, the Internet of Things (IoT), radio-frequency (RF) circuits, and cyber-physical systems., Outils de conception et de simulation électrique (Spice)