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Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Device Integration Engineer - **Company:** Intel Corporation - **Location:** Phoenix, AZ, United States - **Experience:** Experienced - **Salary:** $89,010.0 - $146,440.0 - **Contract:** Permanent contract - **Skills:** BASIC (Programming Language), Data Mining, Python (Programming Language), Minitab, Azure Machine Learning, SAS (Software), Statistical Process Control (SPC), Scripting, JMP (Statistical Software), Yield Optimization - **Published:** November 6, 2026 - **Apply:** https://startup.jobs/ocotillo-technology-fabrication-yield-device-engineer-500-intel-ireland-ltd-10698703 ## About the Role * Highly motivated with leadership qualities * Strong interpersonal skills with understanding of how to work with others to accomplish organizational goals * A collaborative and inclusionary mindset * Highly developed written and verbal communication abilities to influence a wide variety of groups at all levels of the organization * Excellent organizational skills with a strong attention to detail * Experience with setting goals and achieving them on schedule * High tolerance of ambiguity in a rapidly changing, fast-paced work environment with the ability to quickly adjust priorities as necessary * Ability to develop creative solutions to challenging problems * Candidate must be able to effectively run meetings at all levels of the organization in order to effectively solve problems as a team and communicate progress to senior leaders Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school/ work/ classes/ research and/or current job role within the semiconductor manufacturing environment. Minimum Requirements: * Bachelor's of Science in Electrical Engineering, Physics, Material Science, or related STEM field AND 2+ years relevant experience in the semiconductor industry. * Master's of Science in Electrical Engineering, Physics, Material Science, or related STEM field, * A comprehensive understanding of device physics, semiconductor processing, familiarity with failure analysis techniques, basic coding/scripting ability in JSL/SAS/Python, experience in data extraction, statistical process control, statistical data analysis and interpretation, familiarity with statistical software packages such as JMP or Minitab, and familiarity with DOE techniques * Familiarity with latest machine learning tools applied to process and device analysis to accelerate root cause determination * Experience in semiconductor process integration, yield engineering, process development, or technology development. * Strong understanding of FEOL and/or BEOL manufacturing processes. * Demonstrated experience in project execution, including design of experiments (DOE) and process improvement, in areas of yield improvement, defect reduction, or process capability enhancements in a production environment. * Proficiency in statistical analysis methods including DOE, SPC, Cp/Cpk analysis, and root-cause methodologies. * Experience supporting technology qualification, manufacturing ramp, and high-volume production. * Demonstrated ability to lead complex technical projects across multiple engineering disciplines. Job Type ## Description As a Device Integration Engineer, your responsibilities may include but are not limited to: * Driving the factory to produce transistor and discrete electronic devices that perform according to strictly defined specifications. * Collaborating with Module, Integration, and Yield engineers to perform process modifications to produce material that meets quality, reliability, cost, yield, and performance requirements. * Strictly controlling the initial quality metrics at the end-of-line (EOL) in order to screen and disposition material prior to sort and class testing. Extensive analyses are performed in order to determine specific root causes of discrepant device performance. * Continuously improving quality, reliability, cost, and yield using a feedback loop through Integration and Module engineers to address targeting, variability reduction, and containment of poorly performing line segments * Developing solutions to challenging technical problems utilizing a combination of fundamental knowledge of solid-state physics, statistics, and formal problem-solving methodologies. * Independently identifying improvement opportunities and driving implementation * Summarizing complex problems using formal problem-solving strategies and communicating technical reasoning, project timelines, and help needed to senior leaders * Engaging with senior leaders from multiple teams, such as product engineers, assembly test engineers, and technology development engineers to understand and implement process improvement opportunities.