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# Sr. Director, Chiplets/FCBGA Integration

- **Company:** Micro Inc
- **Location:** Tempe, AZ, United States
- **Experience:** Expert
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Data Centers, Package Development Process, Statistical Process Control (SPC), High Performance Computing
- **Published:** November 10, 2026
- **Apply:** https://www.juju.com/job/28_25197_d09aadf171122343cd3460a7331ba810

## About the Role

* This position requires a Bachelor's degree in Engineering (Mechanical Engineering or Materials Science and/or graduate studies in these disciplines are highly preferred). Master's degree preferred.
 * 12+ years of experience in semiconductor packaging development is required.
 * Demonstrated experience leading advanced packaging or product development programs within a global organization.
 * Strong understanding of IC package design environments and the trade-offs associated with package design for FCBGA and heterogeneous module-based package development.
 * Working knowledge of mechanical stress/strain and IC package warpage derived from packaging materials and mechanical configurations.
 * Familiarity with Co-Packaged Optics, current trends, and performance drivers.
 * Experience influencing technical roadmaps and driving alignment between customer requirements and internal development priorities.
 * Previous product or program management experience involving offshore development teams is highly desired.
 * Deep knowledge of IC packaging materials, failure modes, and reliability qualification procedures.
 * Excellent written, verbal, and customer-facing communication skills.
 * Ability to work effectively across global organizations and cultures.
 * This position requires 20% domestic and 20% international travel., * Demonstrated experience developing package technology roadmaps for AI accelerators, high-performance computing, and data center applications.
 * Expertise in Fan-Out IC Packaging, including low-density (LDFO), high-density (HDFO), and bridge-based heterogeneous products.
 * Expertise in large-body FCBGA packaging, including warpage control, stress management, underfill, and TIM materials.
 * Working knowledge of semi-additive plating chemistries and equipment.
 * Familiarity with Design of Experiments (DOE) and Statistical Process Control (SPC).

## Description

Amkor is currently seeking a Sr. Director, Chiplets/FCBGA for our Tempe, AZ office. The primary function of this position is to lead the strategy, development, and execution of advanced chiplet-based module technologies, including HDFO (High Density Fan-Out) and other advanced IC package solutions for AI, computing, networking, and PC client markets. This individual will serve as a key interface with Tier 1 customers and Amkor's leading-edge R&D center in South Korea, driving technology roadmaps, customer engagement, and successful commercialization of next-generation packaging solutions., * Lead advanced IC package development initiatives with customers and Amkor's development teams in Korea, aligning technical solutions with customer and market requirements.

 * Drive strategic engagement with Tier 1 customers, including technology roadmap discussions, development reviews, and executive-level communications.
 * Champion innovation in package architectures, materials, thermal management, warpage control, and heterogeneous integration technologies.
 * Lead cross-functional teams involving package design, materials characterization, simulation, reliability, and process development resources.
 * Guide product development from concept through qualification, technology transfer, and production ramp.
 * Identify technical and business opportunities to expand Amkor's position in advanced packaging solutions for AI, high-performance computing, and networking applications.
 * Monitor industry trends and emerging technologies to influence product strategy and development priorities.
 * Manage program objectives, schedules, risks, and customer expectations to achieve successful business outcomes.