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# Application Engineer(SW)

- **Company:** Shellback Semiconductor Technology, LLC
- **Location:** San Jose, CA, United States
- **Contract:** Permanent contract
- **Skills:** C (Programming Language), Bluetooth, Communications Protocols, Software Debugging, Embedded Software, PCI Express, Software Engineering, Universal Asynchronous Receiver/Transmitter, Wi-Fi Technology, Network Routers, IEEE 802.11ax
- **Published:** November 11, 2026
- **Apply:** https://www.careerbuilder.com/job-details/application-engineer-sw-san-jose-ca--59796234-afef-4c48-8962-eab097273472

## About the Role

Software Engineering, English Language, Wireless Communications, Internet of Things, Software Development, Software Porting, Wi-Fi, Debugging Skills, Customer Relations, Analysis Skills, * Computer, EE, communications, automation and other related majors, bachelor degree or above.

 * There is no limit to the number of years of service, and we will provide senior or junior positions based on the experience and ability of the candidate.
 * Familiar with C programming, be familiar with embedded software development and debugging process.
 * Familiar with Wi-Fi 6 / Bluetooth protocol and how it works, had Wi-Fi/Bluetooth chip application development experience.
 * Familiar with network protocol and peripheral drivers.
 * Understand USB, PCIe, SDIO, UART and other general peripheral interface protocols.
 * Be experienced working with customers, learning ability and could write technical documents in both Chinese and English.

## Description

Application Engineer(SW) - Senscomm Semiconductor Skip to content

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 * About, * Wireless communication chip peripheral interface application and STA/IoT application solution development.
 * Porting or develop software function modules according to project needs .
 * Participate in the debugging of Wi-Fi 6 /BLE chip software functions.
 * Strong customer focused mindset, be able to analyze and test various problems raised by customers, locate problems and propose effective solutions., Previous articleSenscomm Semiconductor Raised Over 300M RMB in Series A2 Round with additional Strategic Investors to Prepare Mass Production of Several Wi-Fi 6 ChipsetsNext article Technical Marketing Manager