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# Senior Solution Architect

- **Company:** HCL Technologies
- **Location:** Tampa, FL, United States
- **Experience:** Expert
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Computer Engineering, Electronic Design Automation, Ethernet, Design of User Interfaces, PCI Express, Process Driven Development, Signal Integrity, Systems Architecture, Systems Integration, Hfss, Ansys, Network Optimization
- **Published:** November 12, 2026
- **Apply:** https://www.careerbuilder.com/job-details/senior-solution-architect-tampa-fl--303e5d9a-2194-425a-a5f1-ddd154076dfe

## About the Role

Semiconductors, Signal Integrity, System Integration (SI), Architectural Design, Substrate Design, Simulation, Electromagnetism, System Architecture, Manufacturing Systems, Printed Circuit Board Design, HCLTech is looking for an experienced SI/PI Packaging Design Architect with 20+ years of experience in signal integrity, power integrity and semiconductor package design.

The ideal candidate will have strong expertise in high-speed interface design, package and substrate design, electromagnetic simulation, power delivery network optimization and advanced packaging technologies., * 20+ years of experience in semiconductor packaging, signal integrity, power integrity or package/board co-design.

 * Strong knowledge of package substrate design, advanced packaging architectures and high-speed interconnect technologies.
 * Expertise in SI/PI fundamentals, transmission lines, S-parameters, impedance control, crosstalk, reflections and PDN analysis.
 * Hands-on experience with 3D electromagnetic simulation, package extraction and SI/PI sign-off.
 * Experience with advanced package technologies such as FC-BGA, 2.5D/3D IC, chiplets and HBM integration.
 * Knowledge of high-speed protocols such as PCIe, DDR, HBM, SerDes and Ethernet.
 * Proficiency in relevant EDA tools such as Cadence Sigrity, Cadence Clarity 3D Solver, Ansys HFSS, Ansys SIwave or equivalent.
 * Understanding of package stack-up, substrate materials, bump/ball assignments, parasitics, thermal constraints and manufacturing considerations.
 * Strong problem-solving, technical communication and cross-functional collaboration skills.

Other Requirements

 * Experience leading SI/PI architecture, methodology development and technical sign-off for complex semiconductor packages.
 * Exposure to advanced packaging for AI, HPC, networking and high-bandwidth memory solutions.
 * Experience working with global semiconductor customers and multidisciplinary engineering teams.
 * Bachelors or Masters degree in Electronics, Electrical Engineering, Computer Engineering, or related discipline

## Description

The candidate will work closely with silicon design, package design, PCB, system architecture and manufacturing teams to deliver high-performance semiconductor solutions that meet signal integrity, power integrity, thermal and reliability requirements., * Lead Signal Integrity (SI) and Power Integrity (PI) analysis for advanced semiconductor packages and high-speed interconnects.

 * Drive package and substrate design optimization for high-performance computing, networking, AI/accelerator and SoC products.
 * Perform pre-layout and post-layout SI/PI analysis, including crosstalk, insertion loss, return loss, impedance matching and power delivery network (PDN) analysis.
 * Lead package-level and package-to-board co-design activities, including bump maps, escape routing, substrate stack-up and interconnect optimization.
 * Perform electromagnetic (EM) simulations and analyse high-speed interfaces such as PCIe, DDR, HBM, SerDes, Ethernet and other high-bandwidth interfaces.
 * Optimize power distribution networks, decoupling capacitor placement, impedance profiles and simultaneous switching noise.
 * Collaborate with package design, RTL/SoC, PCB, thermal, mechanical and manufacturing teams to resolve design challenges.
 * Define SI/PI design guidelines, simulation methodologies, sign-off criteria and design review processes.
 * Provide technical leadership, mentor engineering teams and drive root-cause analysis for package- and system-level SI/PI issues.
 * Support design feasibility studies, technology evaluation, customer reviews and technical proposals.