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# Signal and Power Integrity Lead Application...

- **Company:** Cadence Design Systems, Inc.
- **Location:** Moylan Township, MN, United States
- **Experience:** Expert
- **Contract:** Permanent contract
- **Skills:** Electronic Design Automation, PCI Express, Signal Integrity, Ripple (payment Protocol), Pcb Layout
- **Published:** June 27, 2026
- **Apply:** https://www.juju.com/job/00000000gb5r10

## About the Role

+ Master's degree in Electrical Engineering , Electronics Engineering, or equivalent professional experience

 + 3-6 years of experience in Signal Integrity, Power Integrity, or a closely related electromagnetic design role

 + Solid background in EDA tools with applied knowledge of IC package and PCB design methodologies

 + Proficiency in SI/PI simulation workflows, including PDN analysis, high-speed protocol characterisation , and 2.5D/3D EM model extraction

 + Fluency in French and English (both written and spoken) - direct customer engagement in French is essential, with internal collaboration conducted in English

 + Valid work and residence permit in France

Additional Skills/Preferences:

 + Hands-on experience with Cadence Sigrity tools and/or the Clarity 3D electromagnetic solver

 + Familiarity with thermal analysis methodologies alongside SI/PI workflows

 + Experience presenting technical content to both technical and non-technical audiences in a customer-facing or pre-sales environment

 + Exposure to emerging high-speed interconnect standards such as UCIe or CEI-OIF

## Description

+ Perform Signal Integrity (SI) and Power Integrity (PI) analysis in both time and frequency domains to support customer design validation and sign-off

 + Apply SI/PI methodologies including IBIS, TDR, impedance control, transmission line theory, and Power Distribution Network (PDN) characterisation across IC package and PCB designs

 + Conduct IR drop and AC-level PDN optimisation to meet target impedance and power ripple requirements on customer use cases

 + Design and configure system-level, time-domain test benches incorporating IBIS-AMI models and interconnect structures for high-speed protocol sign-off (LPDDR5, UCIe, CEI-OIF, and others)

 + Collaborate with customers to analyse IC packages and PCBs using the latest interconnect technologies, including DDR5/LPDDR5 and PCIe 5

 + Drive technical campaigns and software evaluations with customers, delivering clear and compelling technical presentations to varied audiences

 + Train and onboard new customers on Sigrity SI/PI analysis workflows and Clarity 3D full-wave electromagnetic (EM) extraction

 + Partner with internal sales, product engineering, and R&D teams to develop and deliver tailored, customer-focused technical solutions


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