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Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Systems Semiconductor Packaging Engineer - **Company:** Analog Devices - **Location:** United States - **Experience:** Experienced - **Salary:** $75,200.0 - $103,400.0 - **Contract:** Permanent contract - **Skills:** 3d Models, Adobe InDesign, Artificial Intelligence, SolidWorks (CAD), EHealth, Failure Mode Effects Analysis, Reliability Engineering, Statistical Process Control (SPC), Systems Integration, Network Switches - **Published:** June 2, 2026 - **Apply:** https://www.dice.com/job-detail/18ef84bc-29b4-4d43-ae86-09ac3d9456c3 ## About the Role This role will drive product realization from concept through manufacturing by working closely with cross-functional design teams, OSAT, ODM and EMS partners, material suppliers and global manufacturing vendors across multiple time zones. The ideal candidate should have 2 - 5 years of experience in semiconductor packaging, system integration, manufacturing process development and reliability engineering., * Master's degree in engineering (mechanical/ material science/semiconductor engineering/ applied physics or equivalent) * Must have 2 to 5 years of industrial working experience in advanced semiconductor packaging; electronics assembly or systems integration engineering and test. Experience working with OSATs, substrates, EMS partners and semiconductor manufacturing ecosystems. * Strong understanding of advanced semiconductor packages, modules, systems, heterogeneous integration and materials including substrates, adhesives, underfills, mold compounds, TIMs and Interconnect materials. * Familiarity with design controls, thermo-mechanical simulation tools, process development tools and methodologies including DOE, PFMEA, SPC, 8D, RCA and statistical data analysis. * Required to have educational background in fundamentals of materials and their mechanical behavior. Ability to apply them in mechanical design. * Experience with 3D CAD tools (SolidWorks or equivalent) for design reviews and design modifications * Demonstrate engineering aptitude with learning mindset, excellent analytical, and problem-solving skills. * Must be able to demonstrate exceptional communication skills during interview process. * Exposure to working in regulated manufacturing environment for Medical / Industrial/ Robotics devices will be a distinct advantage. ## Description * Work closely with cross-functional teams to design and develop advanced systems level packaging solutions including heterogeneous packaging solutions, multi-chip modules, sensor packages and high-density interconnect assemblies. * Lead assembly process developments to support Digital Health Care, Medical Devices, Industrial, Robotics and Physical AI applications. Adheres to strict documentation practices in a regulated environment and owns design control processes. Engineer new materials, processes and assembly capabilities to suit to end applications. * Own manufacturing engineering activities including process characterization, collaborate with QA and Reliability teams to drive root cause analysis, yield improvements and Corrective/ preventive actions (CAPA) to meet manufacturability, scalability, and cost optimizations. * Drive PFMEA, DOE, SPC, GR&R and statical analysis activities to improve process capability, assembly robustness and long-term reliability. * Work closely with OSATs, substrate vendors, PCB suppliers and assembly partners to define package architecture, DFM/DFX requirements and qualification strategies. Takes accountability in design and process development for high volume production. Benchmark industry best practices and evaluate emerging technologies for design and process innovation. * Ability to collate information with appropriate supporting data and present into a coherent report for communication and distribution. * Communicate complex technical concepts effectively to global engineering, operations, suppliers and executive teams. ## Related Videos - [TresJS a new declarative ThreeJS as Vue components](https://www.wearedevelopers.com/videos/543-tresjs-a-new-declarative-threejs-as-vue-components) - [The Billion Dollar Machine: First Time Right.](https://www.wearedevelopers.com/videos/393-the-billion-dollar-machine-first-time-right) - [Cross platform Augmented Reality development with React Native](https://www.wearedevelopers.com/videos/160-cross-platform-augmented-reality-development-with-react-native) - [More efficient software for more efficient microchips](https://www.wearedevelopers.com/videos/1164-more-efficient-software-for-more-efficient-microchips) - [How to Domain Model – An example from manufacturing](https://www.wearedevelopers.com/videos/742-how-to-domain-model-an-example-from-manufacturing) - [Debugging Machine Learning Code](https://www.wearedevelopers.com/videos/71-debugging-machine-learning-code) ## Related Articles - [Now is the time for industrialized software development](https://www.wearedevelopers.com/magazine/601-now-is-the-time-for-industrialized-software-development) - [How software is steering vehicle technology](https://www.wearedevelopers.com/magazine/515-how-software-is-steering-vehicle-technology) - [Is Software Engineering Over-Saturated?](https://www.wearedevelopers.com/magazine/418-is-software-engineering-over-saturated) - [Where To Find Software Engineering Jobs](https://www.wearedevelopers.com/magazine/396-where-to-find-software-engineering-jobs) - [Events like RSAC Get You CISOs. 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