Sr. Principal Hardware Architect for Optical...
Role details
Job location
Tech stack
Job description
*Lead the design of PAM4 optical transceivers for datacenter, AI/ML, HPC applications from concept to high-volume production ready
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Define and implement the electrical/optical architecture of pluggable/co-packaged optical transceivers meeting customers' requirements
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Work cross-functionally with FW/SW, OSA (optical sub-assembly), process development, Q&R, program/product management to develop fully compliant optical transceivers
*Lead the integration of optical, hardware, FW/SW, and process, including troubleshooting and yield improvement
*Create various drawings, BOM and ECO as product design documents, + Mobility within the office environment to attend meetings or interact with colleagues.
Safety Requirements
All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards.
Quality and Environmental Responsibilities
Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System.
Culture Commitment
Ensure adherence to company's values (ICARE) in all aspects of your position at Coherent Corp.
Requirements
*B.S. with typically 10 years of related experience, M.S./Ph.D. preferred
*Strong knowledge and expertise in high-speed RF design, photonics, and optoelectronics
*Expertise on high-speed optoelectronic and RF components - designs, specifications, characterization, performance, and qualification
*Solid foundation of understanding: signal/power integrity (SI/PI), system integration of FW/SW and HW with respect to functionality and performance, optomechanical design
Skills
*Excellent communication and presentation skills
*Strong analytical problem-solving skills for product design and debug
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Hands-on technical background in PAM4 optical transceiver designs - EML, Silicon Photonics, DSP, driver, TIA, PCB/PCBA, electrical and optical packaging
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High-density multiple-layer PCB designs
*Experience in RF analysis and design using modeling tools such as CST or HFSS
*Optical and electrical lab measurement skills, including script-based test automation, + Sitting for extended periods while working on a computer or conducting meetings.
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Use of hands and fingers for typing, writing, and handling documents.
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Occasional lifting of objects or materials up to 20 pounds for administrative tasks.
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Ability to communicate verbally and in writing.
Benefits & conditions
- May require occasional off-site meetings or travel