New College Grad - Computer Science - Advance Packaging Technology Development (APTD)
Role details
Job location
Tech stack
Job description
This role focuses on applying software, data analytics, modeling, and automation to enable next-generation advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and heterogeneous integration. The engineer will work closely with packaging, process, equipment, and various cross functional teams to improve design efficiency, yield, quality, reliability, and time-to-market through data-driven solutions., * Develop and apply data analytics, modeling, and automation solutions to support advanced packaging technology development, qualification, or ramp activities.
- Analyze large, multi-source datasets (process, metrology, yield, reliability, FA/RMA) to identify trends, correlations, and improvement opportunities in advanced packaging flows.
- Build and maintain scripts, dashboards, models, or ML workflows to enable packaging health monitoring, yield learning, and process optimization.
- Collaborate cross-functionally with package design, process development, equipment, materials, manufacturing, and quality teams to translate packaging problems into computational or data-driven solutions.
- Support root cause analysis (RCA) for package defects, yield excursions, and customer returns using statistical, analytical, and visualization techniques.
- Enable traceability, automation, and digital workflows across packaging development and NPI processes.
- Contribute to documentation, methodology development, and best-practice sharing within the Advanced Packaging organization.
- Note: Role and Responsibilities may change according to business needs
Requirements
Do you have experience in Cross-functional communication?, Do you have a Bachelor's degree?, We are seeking a highly motivated New College Graduate (NCG) to join the Advanced Packaging Technology Development (APTD) organization as an Advanced Packaging Engineer with a Computer Science, Computer Engineering, or Data Science background., * BS or MS in Computer Science, Computer Engineering, Data Science, or a closely related field. Candidates must have completed a Bachelor's or Master's degree within the past two years.
- Strong foundation in programming and data analysis (e.g., Python, SQL, MATLAB, R, or equivalent).
- Knowledge of statistics, data mining, machine learning, or optimization techniques.
- Ability to work with complex technical problems and translate physical or process challenges into analytical models.
- Strong communication skills and ability to collaborate across multidisciplinary engineering teams., * Exposure to semiconductor manufacturing, advanced packaging, or hardware systems, through coursework, research, or internships.
- Experience with data visualization, dashboards, or workflow automation.
- Familiarity with modeling, simulation, or AI/ML applications in engineering or manufacturing environments.
- Understanding of yield analysis, process control, or reliability data (academic or internship experience acceptable).
- Interest in HBM, 2.5D/3D packaging, hybrid bonding, or heterogeneous integration technologies.
Benefits & conditions
Pulled from the full job description
- Health insurance
- Paid time off
- Vision insurance
- Dental insurance
- Family leave
- Paid holidays, The US base salary range that Micron Technology estimates it could pay for this full-time position is:
$66,000.00 - $139,000.00 a year
Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.