Modem HW Design Engineer - AI Driven Next Gen Modem Hardware Development
Role details
Job location
Tech stack
Job description
We are seeking a highly skilled Modem Hardware Design Engineer to join our advanced design organization, focused on AI-driven methodologies and next-generation modem hardware development. This role blends traditional design expertise with cutting-edge GenAI, ML-assisted flows, and agentic-AI automation frameworks to accelerate all phases of the project and deliver leading edge solutions across a wide range of portfolio products.
As a Wireless Design Engineer, you will define specifications and architecture/micro-architecture, develop RTL, and optimize for area, power, and performance. You will collaborate closely within the hardware team comprising verification, modeling, and physical implementation teams, while also engaging with system, RF, firmware, and software teams to deliver first-time-right silicon.
Requirements
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Bachelor's degree in Computer Engineering, Computer Science, Electrical Engineering, or related field and 6+ years of Software Engineering, Hardware Engineering, Electrical Engineering, Systems Engineering, or related work experience., Master's degree in Computer Engineering, Computer Science, Electrical Engineering, or related field and 5+ years of Software Engineering, Hardware Engineering, Electrical Engineering, Systems Engineering, or related work experience. OR PhD in Computer Engineering, Computer Science, Electrical Engineering, or related field and 4+ years of Software Engineering, Hardware Engineering, Electrical Engineering, Systems Engineering, or related work experience., * BS or MS degree and 5+ years of relevant industry experience
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Strong expertise in RTL coding and logic design for wireless modem ASICs or custom datapath components for DSP applications
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Solid understanding of Verilog, SystemVerilog, C/C++, and SystemC
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Experience with synthesis, industry LINT, clock domain crossing, low power design and verification
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Background in wireless/wireline modem technology, DSP, or communication systems
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Knowledge of 4G/5G 3GPP physical layer standards is a strong plus
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Ultra-deep sub-micron CMOS technology nodes such as 4nm and below
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Experience with Generative AI, ML, or agentic-AI-based automation
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Proficiency with Unix/Linux shell scripting, Python/Perl, Makefiles, XML
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Excellent communication, collaboration, and critical-thinking skills
Benefits & conditions
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link .