ADCE Packaging Design Architect

Intel View all jobs
Chandler, United States of America
1 month ago

Role details

Contract type
Permanent contract
Employment type
Full-time (> 32 hours)
Working hours
Regular working hours
Languages
English
Experience level
Senior
Compensation
$ 88K

Job location

Chandler, United States of America

Tech stack

Adobe InDesign
Software Debugging
Logic Synthesis of Circuits
Hardware Description Language
Pcb Layout
Ansys

Job description

Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design. Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs. Works closely with silicon and hardware teams to optimize silicon-package-board performance and pinout. Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design. Completes documentation and collateral into the product lifecycle management system of record., Summary - The Design Managers focus will be to oversee the development and delivery of large, overly complex products related to the semiconductor industry. The Design Manager wi…

  • 1 month ago
  • Apply easily

Requirements

  • Self-motivated engineer who has strong technical background in design and electrical analysis.
  • Solid background in semiconductor fabrication and packaging
  • Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions. - Ability to work independently and at various levels of abstraction
  • Strong organization, time management, and communication skills, self-motivated.
  • Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.
  • Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
  • Experience and knowledge with assembly process, test and characterization techniques preferred

Qualifications:

  • Ph.D./master's in electrical engineering/ chemical engineering/ mechanical engineering or Material Science.
  • 10+ years and in-depth knowledge/background in Package, PCB design, or IC digital design.

Benefits & conditions

Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth., We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the . Annual Salary Range for jobs which could be performed in the US: $220,920.00-311,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter., + $85,000-88,400 per year Job Profile: Construction and Planning Analyst 3 Job Family: Construction and Planning Time Type: Full time Max Pay - Depends on experience: $88,400.00 USD Annual Apply bef…

  • 2 months ago

Apply for this position