Technical Staff Member (IT)

We are seeking a highly skilled Technical Staff Member (IT) to support database administration / management, cloud infrastructure, and network operations within a cutting-edge semiconductor manufacturing (fab) environment. This role is critical to enabling high-volume manufacturing, real-time data systems, and secure, scalable infrastructure supporting MES, equipment integration, and advanced analytics platforms.

The ideal candidate brings deep expertise across database technologies, cloud platforms, and networking, with experience supporting mission-critical, high-availability environments in semiconductor or advanced manufacturing settings.

Responsibilities:

Database Administration/ management: Administer, maintain, and optimize enterprise databases (Oracle, PostgreSQL, SQL Server, MySQL) supporting fab systems, MES, and analytics platforms Perform database installation, configuration, patching, upgrades, and migrations across on-prem and cloud environments Design and implement high availability and disaster recovery solutions (replication, clustering, backup/recovery strategies) Monitor and tune database performance (query optimization, indexing strategies, execution plans) to support high-volume manufacturing data workloads Manage database security, access controls, and compliance requirements (encryption, user roles, auditing) Support ETL pipelines, data warehousing, and large-scale data processing systems Troubleshoot database issues impacting fab operations, yield systems, and production tools

Cloud Infrastructure (AWS / Azure / GCP): Design, deploy, and manage cloud-hosted database platforms and hybrid architectures Support cloud-native services (RDS, Azure SQL, BigQuery, Kubernetes-integrated data platforms, etc.) Lead cloud migration initiatives for legacy manufacturing and engineering systems Optimize cloud cost, performance, and scalability for high-throughput fab data environments Implement infrastructure-as-code (Terraform, ARM, CloudFormation) for repeatable deployments Ensure compliance with cybersecurity and data governance frameworks

Networking & Infrastructure: Support and maintain networking infrastructure for fab IT systems, including low-latency, high-reliability environments Configure and troubleshoot VLANs, firewalls, load balancers, DNS, and routing protocols Ensure secure connectivity between fab systems, cloud platforms, and external partners Partner with infrastructure and security teams to enforce network segmentation and data protection standards Support data pipelines and real-time communication between MES, equipment interfaces, and analytics systems

10+ years of experience working in enterprise IT environments Solid understanding of networking fundamentals (TCP/IP, DNS, firewalls, routing) Hands-on experience with cloud platforms (AWS, Azure, or GCP) Strong data administration or management experience Semiconductor manufacturing or high-volume manufacturing environment experience (fab, MES, equipment data systems) Bachelor's degree in Computer Science, Information Systems, Engineering, or related field

Benefit packages for this role will start on the 1st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.

Insight Global is looking for Technical Staff Member (IT) to work on site in Austin, TX and support the strategy and introduction of products based on unique and highly differentiated capabilities of a preeminent foundry for semiconductor systems and defense electronics companies. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing technology that will define future roadmaps of semiconductor devices including logic, memory, 3D packaged devices.