Lead Software Engineer

This role is responsible for designing and delivering system-level test PCBs that enable the client’s high-power integrated circuit products to be validated, tested, and deployed across internal and external manufacturing partners., Collaborate with Product Test and Firmware/Software teams to define SLT system architecture and translate requirements into PCB designs. Design and capture schematics for SLT and bench PCBs using Allegro CAD tools, supporting high-power AI silicon applications. Create and maintain PCB component libraries, ensuring accuracy of component pinouts and footprints. Audit PCB layouts against design rule checks and work with layout, SI, and mechanical engineers to meet all electrical and thermal requirements. Manage vendor relationships throughout the PCB fabrication and assembly process, including deliverables, design file archival, and production-hardening. Test manufactured PCBs, manage inventory and test status, and execute debug, rework, and ECOs as needed for deployment to internal and external customers. Apply systems-level thinking across hardware, firmware/software, mechanical, and manufacturability considerations to deliver complete test solutions.

Must be authorized to work in the U.S. This position is not eligible for sponsorship ., Bachelor’s degree in Electrical Engineering. 12 or more years of experience developing PCBs through manufacturing and test. In-depth experience with schematic capture using Allegro (Cadence Capture CIS strongly preferred; Altium or Mentor Graphics considered with strong design background). Experience managing vendors in a PCB manufacturing process, including fabrication and assembly. Experience with production-hardening of PCB designs. Familiarity with high-speed PCB design techniques including blind/buried vias, backdrilling, channel loss, and crosstalk mitigation.

Preferred Qualifications: Experience designing PCBs for high-power systems (200W or more per rail, 1-3kW or more overall), with simulation skills related to Power Delivery Network design. Experience implementing detailed via structures for BGAs and connectors, with a solid understanding of transmission line fundamentals. Comfort working with command-line Linux OS-based programs and scripting. Familiarity with hardware/software interfaces and embedded software design constraints such as memory, power, and speed. Willingness to travel internationally (Taiwan, Malaysia, or Korea) on an occasional basis. *, Bachelor’s degree in Electrical Engineering. 12 or more years of experience developing PCBs through manufacturing and test. In-depth experience with schematic capture using Allegro (Cadence Capture CIS strongly preferred; Altium or Mentor Graphics considered with strong design background). Experience managing vendors in a PCB manufacturing process, including fabrication and assembly. Experience with production-hardening of PCB designs. Familiarity with high-speed PCB design techniques including blind/buried vias, backdrilling, channel loss, and crosstalk mitigation.

Preferred Qualifications: Experience designing PCBs for high-power systems (200W or more per rail, 1-3kW or more overall), with simulation skills related to Power Delivery Network design. Experience implementing detailed via structures for BGAs and connectors, with a solid understanding of transmission line fundamentals. Comfort working with command-line Linux OS-based programs and scripting. Familiarity with hardware/software interfaces and embedded software design constraints such as memory, power, and speed. Willingness to travel internationally (Taiwan, Malaysia, or Korea) on an occasional basis.