Modem HW Design Verification Engineer (AI Driven Next Gen Modem Hardware Development)
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Job description
We are seeking a highly skilled Modem Hardware Design Verification Engineer to join our advanced verification organization, focused on AI-driven verification methodologies and next-generation modem hardware development. This role blends traditional DV expertise with cutting-edge GenAI, ML-assisted flows, and agentic-AI automation frameworks to accelerate coverage closure, improve debug efficiency, and enhance overall verification throughput.
As a Wireless DV Engineer, you will define and execute verification plans, build reusable verification environments, and apply advanced verification techniques to validate complex wireless baseband and subsystem designs. You will collaborate closely with system, firmware, and RTL design teams to ensure first-time-right silicon for high-performance modem products.
Requirements
Do you have experience in XML?, * Bachelor’s degree in Computer Engineering, Computer Science, Electrical Engineering, or related field and 2+ years of Software Engineering, Hardware Engineering, Electrical Engineering, Systems Engineering, or related work experience., Master’s degree in Computer Engineering, Computer Science, Electrical Engineering, or related field and 1+ year of Software Engineering, Hardware Engineering, Electrical Engineering, Systems Engineering, or related work experience. OR PhD in Computer Engineering, Computer Science, Electrical Engineering, or related field., * BS or MS degree and 5+ years of relevant industry experience
- Strong expertise in verification planning, testbench architecture, assertions, debugging, and problem solving
- Hands-on constrained-random verification using SystemVerilog with UVM/OVM , including functional/code/assertion coverage
- Solid understanding of Verilog/VHDL, C/C++, SystemC , and scripting (Python/Perl)
- Experience with Generative AI, ML, or agentic-AI-based verification automation , AI-guided test generation, or ML-based regression optimization
- Background in wireless/wireline modem technology , DSP, or communication systems
- Knowledge of 4G/5G 3GPP physical layer standards is a strong plus
- Experience with simulation acceleration , formal verification , and HW/SW co-verification
- Strong OOP programming skills and/or RTL design exposure
- Proficiency with Unix/Linux shell scripting, Perl, Makefiles, XML, and verification automation frameworks
- Excellent communication, collaboration, and critical-thinking skills
Benefits & conditions
4.04.0 out of 5 stars 90 Central Street, Boxborough, MA 01719 $128,000 - $192,000 a year, Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits : $128,000.00 - $192,000.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link .
About the company
Qualcomm Technologies, Inc., Qualcomm is the world’s largest fabless semiconductor company and a global leader in wireless innovation-powering the majority of 3G, 4G, and 5G devices while pioneering the future 6G era. Our hardware engineering teams build industry-leading modem and RF transceiver solutions enabling the next generation of wireless technology.
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