3D-IC Application Engineer

MSEE/BSEE with 4+ years design experience. Significant experience in advanced IC Package layout design and/or interposer layout design. Experience with IC design is a plus. Necessary technical skills include satisfying many of these areas:

• Knowledge of IC Package Design (Cadence APD/SiP, Siemens Xpedition/i3DL) is required.
• Practical experience with Package design tools from design setup (stackup/constraints/etc), to implementation (routing/outgassing/re-use/etc), through generation of manufacturing documents is required.
• Familiarity with Package / Interposer planning solutions (Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Excel) is preferred.
• Familiarity with 2.5D and 3D chiplet-based design solutions (TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, etc.) is preferred.
• Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS, etc.) is desired.
• Familiarity with signal/power integrity tools (HyperLynx, Sigrity, SIWave, ADS, etc) and analysis flows is preferred
• Experience with Siemens Calibre DRC, LVS, and/or 3DSTACK solutions is highly desirable.
• Above average competency with Microsoft Word, Excel, and PowerPoint.
• Scripting/Programming: VBS, Python, Tcl, Perl, or similar languages.
• Working OS knowledge of Windows and Linux.
• Prior experience as an Applications Engineer is preferred.

The ideal candidate will:

• Possess a passion to learn and perform at the cutting edge of technology.
• Have a desire to broaden exposure to the business aspects of the technical design world.
• Enjoy contributing to the success of a great team.
• Be able to work independently with minimal supervision.
• Effectively influence people at any level.
• Enjoy helping and motivating others to be successful.
• Demonstrated ability to build strong rapport and credibility with customer organizations while maintaining a company internal network of contacts.
• Be willing to travel domestically and internationally.

4.04.0 out of 5 stars Wilsonville, OR Hybrid work $250,600 a year - Full-time

As an Applications engineer with Siemens EDA Technology Solutions Sales, you will support consultative sales efforts at the world’s leading semiconductor and electronic equipment manufacturers.

As an Applications Engineer at Siemens EDA, your primary responsibility is to secure technical design wins for Siemens EDA’s product and service offerings. Specifically, you will be responsible for technical wins with the industry leading solutions Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, and other product families. Responsible activities will include delivery of technical presentations, conducting product demonstrations and benchmarks, and participation in development of solutions and account strategies leading to market share gains for Siemens. This position is also expected to help architect and prototype Siemens EDA’s emerging 3DIC solution through the development of flows and integration scripts to link tools into a solution.

Your territory coverage consists of Key Accounts located throughout the US. You will be responsible for integrating with peers located all over the world, communicating essential status to a variety of stakeholders and influential customers. International travel may be required.