Associate Engineer (Integration)

QCi is seeking a motivated Associate Engineer to join our Integration Engineering team. In this role, you will work at the forefront of emerging semiconductor technologies including 2.5D/3D heterogeneous integration, hybrid bonding, photonics, quantum devices, microfluidics, MEMS, and more. This is an excellent opportunity for an early-career engineer to develop deep expertise across a broad range of cutting-edge technology while working in a dynamic, collaborative fab environment. Duties / Responsibilities:

• Support Integration Engineers in designing and optimizing process flows for advanced packaging applications.
• Write process travelers that translate customer designs into functional devices
• Assist in the evaluation, characterization, and documentation of new product flows and unit processes, identifying opportunities for improvement
• Monitor wafer yields across process steps; identify, root-cause, and eliminate yield-limiting defects and process excursions
• Maintain thorough and accurate wafer/lot processing records with a focus on traceability.
• Create detailed and technical presentations to present to customers and various levels of management
• Serve as a cross-functional resource, interfacing effectively with technicians, engineers, management, and customers
• Uphold a safe, clean, and compliant work environment including proper chemical labeling, waste disposal, and adherence to all EHS and OHSA protocols

• Bachelor’s degree in Engineering, Applied Physics, Materials Science, Semiconductor Engineering, or a related technical discipline.
• 1+ years of semiconductor industry experience, internship experience, co-op experience, or equivalent hands-on laboratory experience.
• Working knowledge of semiconductor fabrication and manufacturing processes.
• Familiarity with wafer processing, characterization, and process development methodologies.
• Strong analytical and problem-solving skills.

• Ability to work effectively in a fast-paced development and manufacturing environment. Technical Skills Strong knowledge of semiconductor manufacturing processes, including:

• Thin Films
• Wafer Bonding
• CMP (Chemical Mechanical Planarization)
• Deposition
• Etch

• Photolithography

• Understanding of process integration principles and semiconductor device fabrication.
• Experience using or interpreting SPC (Statistical Process Control) methods to monitor and improve process performance.
• Familiarity with DOE (Design of Experiments) methodologies.
• Proficiency with: Microsoft Office Suite, JMP, Excel-based data analysis tools

• Ability to generate technical documentation, process reports, and customer-facing presentations. Additional Preferred Skills:

• Experience supporting process development, integration engineering, or advanced packaging initiatives.

• Exposure to technologies such as: o 2.5D/3D Integration o Hybrid Bonding o Photonics o Quantum Devices o Microfluidics o MEMS

• Experience working with various metrology tools such as profilometers, reflectometers, microscopes, probers, etc.
• Experience with yield analysis, process characterization, and defect reduction activities.

• Experience supporting customer-driven development projects. Personal Attributes

• Collaborative team player who also performs effectively in independent roles
• Clear and concise communicator (both written and verbal)
• Strong analytical and problem-solving mindset with a bias toward action
• Customer-focused professionalism to manage and exceed expectations
• Demonstrates leadership initiative and the ability to take on increasing ownership over short periods of time

• Flexible, adaptable, and enthusiastic about contributing in a high-growth startup culture Work Conditions & Physical Requirements

• Work in a fully gowned cleanroom environment.
• Required PPE includes safety glasses, face shield, gloves, and steel-toe shoes.
• Ability to stand, walk, bend, and work with machinery throughout the shift.
• Frequent handling of small components, tools, and manufacturing equipment.
• Ability to lift and move materials weighing up to 45 lbs.
• Flexible to work alternate shifts based on business needs.
• Position requires a high level of daily physical activity and movement. Quantum Computing Inc. (QCi) is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or any other characteristic protected by applicable federal, state, or local law. Incumbent(s) in this position may be required to perform other duties and special assignments not specifically stated above. Statements outlined in this section are designated as essential job functions in accordance with the Americans with Disabilities Act of 1990.

Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an innovative, integrated photonics company that provides accessible and affordable quantum machines to the world today. QCi products are designed to operate at room temperature and low power at an affordable cost. The Company’s portfolio of core technology and products offer unique capabilities in the areas of high-performance computing, artificial intelligence, cyber security as well as remote sensing applications.