Senior Manager, HBM Customer Integration Technical Leader

As part of the Customer Engineering Technical Leadership (CETL) function within HIG PSE, the Technical Leader will serve as a key technical interface between external customers and internal engineering teams. In conjunction with CIL (Customer Integration Lead), this role requires deep technical engagement to understand customer application requirements and align them with internal HBM design, product engineering, and manufacturing processes (Front-End and Back-End). The position emphasizes technical problem-solving, multi-functional teamwork, and driving integration success for advanced HBM products. Develops and deploys AI systems that help automate processes and tackle technical challenges. Responsibilities:

• Develop a strong understanding of customer system architecture, application requirements, and integration challenges.

• Translate customer technical needs into actionable requirements for internal design, product engineering, and manufacturing teams.

• Provide technical mentorship on HBM architecture, signal integrity, thermal solutions, and packaging strategies.

• Develops and deploys AI (artificial intelligence) systems that help automate processes and tackle technical challenges

• Work closely with internal teams across front-end/back-end process engineering, product development, and manufacturing to ensure seamless integration.

• Support design reviews, failure analysis, and yield improvement initiatives tied to customer requirements.

• In conjunction with CIL, participate in technical discussions with customers, including design reviews and debug sessions.

• Communicate technical solutions clearly and optimally to both customer engineering teams and internal collaborators.

• Lead root-cause analysis for integration issues and propose design or process optimizations.

• Ensure timely resolution of technical partner concerns and maintain alignment across engineering and manufacturing teams.

• Lead the strategy, development, deployment, and adoption of engineering capabilities powered by intelligent technology that accelerate product development across system validation, debug, characterization, and customer enablement workflows.

Preferred Qualifications:

• Bachelor’s or Master’s degree or equivalent experience in Electrical Engineering, Computer Engineering, or related technical field.

• 10+ years in semiconductor product engineering, system integration, or customer-facing technical roles.

• Hands-on experience with HBM architecture, packaging, and manufacturing processes highly desired.

• Ability to interpret customer system-level requirements and map them to internal design and process capabilities.

• Excellent communication and collaboration skills across technical and non-technical teams.

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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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