Director of Field Applications Engineering
Baya Systems
Cambridge, UK
1 day ago
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Role details
Contract type
Permanent contract
Employment type
Full-time (> 32 hours)
Experience level
Expert
Experience required
5 years minimum
Working hours
Regular working hours
Languages
Chinese, English, German, Japanese, Korean
Job source
Tech stack
Artificial Intelligence
Application Notes
Computer Engineering
Data Centers
Electronic Design Automation
PCI Express
Application Specific Integrated Circuits
Job description
Team Leadership & Development
- Manage: Lead a distributed team of senior FAEs across EU and APAC.
- Hire: Recruit and onboard top-tier engineering talent in key regional hubs.
- Coach: Provide continuous technical mentorship and professional development.
- Align: Set clear regional goals aligned with corporate business objectives.
- Grow collaterals , to enable improved efficiency / easy of adoption by the customer
Technical Account Management & Sales Support
- Drive Strategy: Partner with regional sales directors to secure high-value design wins.
- Own Delivery: Act as the escalations point for critical customer technical issues.
- Guide Evaluation: Oversee customer proof-of-concepts, evaluations, and architectural reviews.
- Present: Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives.
Product & Ecosystem Collaboration
- Feedback Loop: Funnel regional customer requirements directly to internal R&D and Product Management.
- Influence Roadmap: Use market insights to shape the future fabric interconnect IP roadmap.
- Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems.
Requirements
- Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
- Management: 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support).
- Industry: 10+ years in the semiconductor, silicon IP, or high-performance networking sectors.
Technical Expertise
- IP Knowledge: Deep understanding of Network-on-Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.
- Design Flow: Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).
- Systems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements.
Soft Skills & Logistics
- Communication: Exceptional English verbal and written communication skills.
- Cross-Cultural: Proven experience managing teams and clients across diverse cultures in Europe and Asia.
- Autonomy: Self-motivated style suited for a fast-paced, early-stage startup environment. [1], * Master’s degree or PhD in Electrical or Computer Engineering.
- Prior experience working in a fast-growing, venture-backed silicon IP startup.
- Existing technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC.
- Additional language skills relevant to the covered regions (e.g., Mandarin, Japanese, Korean, German).
Benefits & conditions
- Salary commensurate with experience
- Performance incentives
- Comprehensive medical, dental, and vision benefits
- 401(k) retirement plan
- Equity
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