ADCE Packaging Design Architect

Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design. Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs. Works closely with silicon and hardware teams to optimize silicon-package-board performance and pinout. Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design. Completes documentation and collateral into the product lifecycle management system of record.

• Self-motivated engineer who has strong technical background in design and electrical analysis.
• Solid background in semiconductor fabrication and packaging
• Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions. - Ability to work independently and at various levels of abstraction
• Strong organization, time management, and communication skills, self-motivated.
• Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.
• Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
• Experience and knowledge with assembly process, test and characterization techniques preferred

Qualifications:

• Ph.D./master’s in electrical engineering/ chemical engineering/ mechanical engineering or Material Science.
• 10+ years and in-depth knowledge/background in Package, PCB design, or IC digital design.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the . Annual Salary Range for jobs which could be performed in the US: $220,920.00-311,890.00 USD