TELECOMMUTE Lead Engineer- Hardware Offload

• Implement and optimize hardware-based network offloading (SR-IOV, NFV) for ARM bare-metal compute hosts.
• Investigate, integrate, and benchmark NVLink support for CPU-to-CPU interconnect performance improvements.
• Profile hardware bus bottlenecks, PCIe throughput, and latency characteristics on ARM superchip platforms.
• Deliver technical recommendations and kernel/user-space code enhancements to maximize platform throughput.

• Extensive experience in hardware offloading and systems performance tuning.
• Offload Technologies: Deep background in SR-IOV, NFV (Network Functions Virtualization), and PCIe device pass-through.
• System Programming: Mastery of C and C++ for bare-metal performance engineering.
• High-Speed Interconnects: Experience investigating or implementing hardware interconnect acceleration (such as NVLink CPU-to-CPU performance optimizations).
• Kernel Bypass: Knowledge of DPDK, eBPF, or direct memory access (DMA) drivers., * Bachelor’s or Master’s degree in Computer Science, Computer or Electrical Engineering, Mathematics, or a related field.

GlobalLogic estimates the starting pay range for this role to be performed remotely to be $140,000 to $150,000 and reflects base salary only. This pay range is provided as a good-faith estimate, and the amount offered may be higher or lower. GlobalLogic takes many factors into consideration in making an offer, including candidate qualifications, work experience, operational needs, travel and onsite requirements, internal peer equity, prevailing wage, responsibilities, and other market and business considerations.