Software Engineer (Machine Control/OOD/OOP)

KLA-Tencor
Milpitas, CA, United States
4 days ago
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Role details

Contract type
Permanent contract
Employment type
Full-time (> 32 hours)
Experience level
Experienced
Experience required
3 years minimum
Compensation
$136,300.0 - $199,900.0
Working hours
Regular working hours

Tech stack

Java (Programming Language) Software Applications C++ (Programming Language) Computer Engineering Software Debugging Python (Programming Language) Object-Oriented Software Development Multithreading Information Technology

Requirements

  1. Doctorate (Academic) with at least 2 years of experience OR Master’s Degree with at least 2 years of experience OR Bachelor’s Degree with at least 3 years of experience. Degree in Electrical Engineering or Computer engineering/computer science.

  2. Expertise in object-oriented software design principles and skilled in Object Oriented languages including Java or C++ or Python.

  3. Experience in designing, developing and debugging multi-threaded, parallel and distributed high-performance computing software applications.

  4. Ability to design, develop and debug software to control hardware including any of the following: electro-mechanical systems, opto-mechanical systems, data acquisition hardware, servo control systems, or robotics.

  5. Good communication and leadership skills., Doctorate (Academic) or work experience of 0 years , Master’s Level Degree or work experience of 2 years , Bachelor’s Level Degree or work experience of 3 years

Benefits & conditions

We provide advanced inspection tools, metrology systems, process solutions, and computational analytics that make electronics possible, tackling complex challenges. From electron and photon optics to machine learning and data analytics, we seek perfection at the most fundamental level of matter in the universe. If you want to make electronics that push industries forward and make the world a better place, join us.

Total Rewards Base Pay Range: $136,300.00 - $199,900.00 Annually Primary Location: USA-CA-Milpitas-KLA

KLA’s total rewards package for employees may also include participation in performance incentive programs and eligibility for additional benefits including but not limited to: medical, dental, vision, life, and other voluntary benefits, 401(K) including company matching, employee stock purchase program (ESPP), student debt assistance, tuition reimbursement program, development and career growth opportunities and programs, financial planning benefits, wellness benefits including an employee assistance program (EAP), paid time off and paid company holidays, and family care and bonding leave.

Interns are eligible for some of the benefits listed. Our pay ranges are determined by role, level, and location. The range displayed reflects the pay for this position in the primary location identified in this posting. Actual pay depends on several factors, including state minimum pay wage rates, location, job-related skills, experience, and relevant education level or training. We are committed to complying with all applicable federal and state minimum wage requirements where applicable. If applicable, your recruiter can share more about the specific pay range for your preferred location during the hiring process.

About the company

To make electronics, you need chips, wafers, transistors, reticles, and… To make these, you must see, test and manufacture them at scale-faster and better than ever before. That’s where KLA comes in. Whether you’re early in your career or an experienced professional, you’ll solve complex challenges, work alongside brilliant minds and help shape the future of technology.

Group/Division The Semiconductor Products and Customers (Semi PC) business unit designs, builds and sells KLA’s product portfolio to help chip manufacturers meet high-quality standards for technologies like AI, data centers, automotive and electronic devices. Our inspection, metrology, and analytics systems detect and monitor defects across logic and memory chips, specialty semiconductors, wafers, reticles, advanced packaging, process equipment and materials. We also develop technologies for specialty processes, IC substrates, and PCB manufacturing, including etch and deposition, component inspection, and imaging and analytics. The Broadband Plasma (BBP) division is the market-leading optical inspection system used by logic, foundry, and memory customers to detect critical defects at advanced nodes. These tools combine broadband plasma technology with unmatched sensitivity and speed to support high-volume manufacturing.

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