Applications Scientist

• Lead alpha and beta tool deployments and early customer evaluations of a next-generation X-ray imaging inspection system.
• Partner with customers to inspect advanced packaging formats, including wafers, singulated components, and panels, in high-volume production environments.
• Act as the primary customer contact, and coordinate with internal teams in the U.S. and Japan to define hardware and software improvements and identify new application areas for the technology.
• Support customers remotely and on-site with recipe creation and optimization, tool operation, and data analysis, using deep X-ray imaging expertise to solve challenging applications.
• Provide applications support across a range of X-ray analytical techniques, including imaging, fluorescence, diffraction, and reflectometry.
• Serve as technical lead for product demonstrations, and work with the sales team to understand customer requirements and ensure satisfaction throughout the sales process.
• Assist the service team with new tool installations, and perform in-depth analysis to troubleshoot tool issues.
• Author technical documentation and application notes, and develop and maintain training materials. Communicate complex technical topics clearly to a wide range of audiences.
• Build and maintain positive, productive relationships with customers and colleagues at all levels.
• Travel up to 20% to customer sites, primarily within the United States, with occasional international trips.

Our client is seeking an Applications Scientist to support a newer X-ray imaging inspection technology. This is a local, customer-facing role focused on getting early-stage tools successfully deployed and evaluated. Direct semiconductor industry experience with X-ray imaging and a track record of successful alpha tool implementation are strongly preferred. Experience in advanced packaging is highly desirable., * Ph.D. or M.S. in Materials Science, Physics, Chemistry, Solid State, or a related engineering field.

• Minimum of three years of experience as an applications scientist or applications engineer at a semiconductor metrology tool manufacturer, or as a process engineer at a semiconductor device manufacturer with thin film quality control or metrology experience.
• Hands-on, independent experience with metrology equipment in the semiconductor industry.
• Direct experience with X-ray imaging applications in semiconductor manufacturing and successful alpha tool implementation (strongly preferred).
• Strong understanding of semiconductor device manufacturing processes, including advanced packaging.
• Strong grounding in the fundamentals of X-ray physics, spectroscopy, diffraction, and scattering.
• Excellent analytical and problem-solving skills, such as root cause analysis and the 5 Whys method.
• Proficiency in data analysis, with working knowledge of statistics and statistical process control.
• Basic programming or scripting skills, such as Python, Matlab, or VBA.
• Fluent English communication skills, both written and verbal. Intermediate proficiency in Japanese, Chinese, Korean, or Hebrew is a plus.
• Ability to travel up to 20%, with occasional international travel.