System IC Architect

We are seeking a visionary System IC Architect with deep expertise in system-level architecture, high-performance power conversion, and semiconductor packaging technologies. This role is pivotal in defining next-generation Point of Load (PoL) solutions for Client, driving innovation in advanced power management with System-in-Package (SiP) integration.

We re looking for a candidate to define products, shape architecture strategy, and support the launch of Point-of-Load (PoL) power solutions that meet latest system-level requirements. Key focus areas include high-performance core power for automotive applications and AI compute platforms. The role centers on Advanced Power Management for PoL solutions. Expertise in AI compute power is essential, and experience in automotive power management is a strong plus.

Key Responsibilities Advanced Power Management & System IC Architecture Product Definition & Strategy

• Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
• Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams.
• Translate customer requirements into innovative packaging and power management solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
• Support development through thermal optimization and electrical analysis.

System-Level Integration

• Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets.
• Lead integration of ICs and power semiconductors into advanced packages and systems. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions. Expertise in System-in-Package (SiP) integration is essential.
• Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms. Knowledge of AI Compute Power Solutions is critical. Automotive Power Management experience is a plus, highly valued.

Thermal Management & Advisory

• Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.

Cross-Functional Leadership

• Collaborate with system, modeling, design, packaging and manufacturing engineering teams to validate and optimize high-performance compute Power designs.
• Act as a technical liaison with customers, supporting co-development and design-in activities.

Technical Advisory & Reporting

• Provide strategic insights on state-of-the-art power management technologies and benchmark readiness. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
• Report KPIs and project status to executive stakeholders.

Preferred Qualifications Power Semiconductor Architect Expertise

• Master s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred).
• 15 years of experience in power semiconductors, packaging, and system-level integration. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions. Expertise in System-in-Package (SiP) integration is essential.
• Proven track record in product definition through revenue realization.
• Strong expertise in thermal management, electrical performance, and advanced reliability.
• Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and knowledge of PCB materials and stack-up.
• Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued.
• Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508).
• Demonstrated ability to lead cross-functional, global teams and manage complex projects.
• Excellent communication and interpersonal skills; ability to collaborate across diverse teams.
• Creative mindset with strong problem-solving capabilities.
• Willingness to travel globally.

Skills: Analysis Skills, Artificial Intelligence (AI), Automotive Engineering, Automotive Management, Automotive Technology, Benchmarking, Cadence, Circuit Simulation, Communication Skills, Computer Architecture, Computer Systems, Cross-Functional, Customer Relations, Customer/Client Research, Electrical Engineering, Electricity, Electronic Engineering, HSPICE, High Level Architecture (HLA), ISO (International Organization for Standardization), Integrated Circuits (ICs), International Electro-Technical Commission (IEC), Interpersonal Skills, Leadership, Leading Edge Technology, Management Strategy, Manufacturing Engineering, PSPICE, Performance Metrics, Performance Tuning/Optimization, Power Management, Printed Circuit Board (PCB), Problem Solving Skills, Product Packaging, Product Planning, Product Strategy, Project/Program Management, Requirements Management, Research & Development (R&D), SIP (Session Initiation Protocol), Safety Standards, Semiconductors, System Architecture, System Integration (SI), Team Lead/Manager, Team Player, Thermal Management, Verilog Hardware Description Language, Willing to Travel