Systems Engineering Manager

Seeking a Systems Engineering Manager to lead a multidisciplinary team responsible for the definition, analysis, and delivery of next-generation power conversion products. This role combines technical leadership with people management, guiding engineers across systems architecture, firmware, package design, and magnetics to deliver integrated DC/DC converter solutions from concept through production., * Manage, mentor, and grow a small team of engineers spanning Systems, Firmware, Packaging, and Magnetics disciplines

• Set individual and team goals aligned with product roadmaps; conduct regular performance reviews and career development planning
• Recruit and onboard new team members as the team scales
• Foster cross-functional collaboration between disciplines that historically operate in silos

Technical Direction

• Guide DC/DC converter architecture definition, including topology selection, power stage design, and control loop analysis/compensation
• Oversee firmware requirements and architecture for digital control, telemetry, and system-level communication (e.g., PMBus)
• Direct package engineering efforts for power packages, balancing thermal, electrical, and manufacturability constraints
• Guide magnetics selection and co-design (inductor/transformer) to meet efficiency, size, and EMI targets
• Review and approve key technical deliverables: architecture documents, control loop stability analyses, package floorplans, magnetics specifications

Program & Cross-Functional Execution

• Partner with Product Marketing, Design, Test, and Package Development teams to define product requirements and specifications
• Own technical risk identification and mitigation planning across the team’s deliverables
• Drive schedule adherence for architecture reviews, tape-out readiness, and testchip milestones
• Represent the team in program reviews, providing status, risks, and technical recommendations to senior management

Process & Quality

• Establish and improve design review processes across Systems, Firmware, Package, and Magnetics
• Ensure design decisions are well-documented and traceable (specs, simulation results, test data)
• Promote reuse of proven architectures, IP blocks, and magnetics solutions across projects, * Team is staffed, aligned on roles, and operating with clear technical ownership across the four disciplines
• Architecture and control loop methodology for current-generation products is well understood and documented
• Cross-discipline design review process is established and running
• At least one testchip or product milestone is delivered on schedule with the team’s technical ownership clearly demonstrated

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position - except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) - may have to go through an export licensing review process.

• MS/PhD in Electrical Engineering or related field

• 7+ years of experience in power electronics, including experience in DC/DC converter design and control loop analysis

• Prior experience leading or mentoring engineers, either as a people manager or senior technical lead

• Working knowledge of firmware/embedded systems concepts as applied to power management (control algorithms, digital compensation, telemetry)

• Familiarity with power package design considerations (thermal management, parasitic inductance, current sensing)

• Familiarity with magnetics design tradeoffs (core material, saturation, winding losses, integration)

• Strong communication skills; able to translate technical detail for both engineers and senior stakeholders, * Experience managing teams spanning multiple engineering disciplines
• Direct hands-on experience with control loop modeling/simulation tools (e.g., SIMPLIS, MATLAB/Simulink)
• Experience with power module or SiP (System-in-Package) development
• Track record of taking products from architecture definition through testchip and into production

The expected wage range for a new hire into this position is $212,520 to $307,740.

• Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today’s innovators stay Ahead of What’s Possible. Learn more at www.analog.com and on LinkedIn and X.