Staff Bench Test Engineer

Qualcomm
Santa Clara, CA, United States
2 months ago

Role details

Contract type
Permanent contract
Employment type
Full-time (> 32 hours)
Experience level
Experienced
Experience required
2 years minimum
Compensation
$151,900.0 - $227,900.0
Working hours
Regular working hours
Job source

Tech stack

.NET Framework Wireless LAN Automation of Tests Bluetooth C Sharp (Programming Language) Network Analysis Computer Engineering Software Debugging Global Positioning Systems (GPS) Python (Programming Language) PCI Express Signal Integrity
+4 more
Wireless Networks Scripting Hardware Testing Information Technology

Job description

  • Developing and executing characterization plans to optimize design parameters, validate specification compliance, and drive initial silicon bring-up and debug.
  • Work closely with different cross-functional teams from initial stages of product definition through release of products to the customers.
  • Engineers in this position will also assist in HW design and debug power integrity (PI) and signal integrity (SI) issues related to package and board design.

Requirements

Do you have experience in Wireless networking?, * Bachelor’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience., Master’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience., * Hands on experience with lab equipment (Oscilloscopes, J-BERT, TDR, Spectrum Analyzers, Vector-Signal Transceivers, Logic Analyzers, Network Analyzers, Noise Source) and test automation.

  • Familiar with RF, mixed-signal, and digital test methods.
  • Experience working with scripting languages like Python, .NET C# is preferred
  • Familiarity with RF/High Speed IO Board Design concepts (Schematic reviews, Layout best practices etc.)
  • Experience in providing failure mode analysis and corrective actions.
  • Familiarity with wireless peripheral standards such as WLAN or other OFDM-based systems, UWB, GPS, FM, and Bluetooth are desirable.
  • Familiarity with protocols such as PCIe/USB/MIPI and DDR is desirable
  • Strong interpersonal, problem solving and debugging skills.

Education:

  • MS EE with 6 years of industry experience/BS EE with 10 years of industry experience

Benefits & conditions

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits : $151,900.00 - $227,900.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link .

About the company

Qualcomm Atheros, Inc., The Post Silicon Engineering group in the Qualcomm Connectivity & Networking division develops test solutions for characterizing WLAN SOCs. The main responsibilities include defining and executing the development of test methodologies and characterization of WLAN Transceivers (802.11a/b/g/n/ac/ax/be/bn), Front End Modules, PLLs, ADCs, DACs, High Speed SERDES Interfaces such as PCIe, USB3, MIPI (DSI, CSI), leading edge LP-DDR & PC-DDR Subsystem components

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