Test and Reliability Leader

• We are seeking an experienced process lead engineer in the field of optical device packaging and assembly with a degree in Mechanical Engineering, Physics or a related field.

What you’ll do

• Lead optical engine and system module assembly with automation and tooling designs to increase UPH & yield and reduce cost with both customized hardware and software development based on SPC and driveCp,Cpkimprovement.

• Support the device packagingRnDand NPI with mechanical design, drawing and thermal modelling.

• Support devicetestingautomation and data analysis automation/scripts or software development and implementation.

• Work withRnDto understand the device specs, particularly mechanical control outline, and assembly requirements andnegotiate between the incoming device MCO, mechanical design, and assembly process based on design improvement and/or experimental data from designed DOEs.

• Work withOSATs tosupport NPI and volume production contract manufacture with technical SOW drafting.

• Act as the technical project manager for owned projects.

• Provide DFM, DFR, and DFTinputs for HQRnDteams for device packaging and assembly.

• Keep proper documentation, and initiateECN andPCN when needed.

• Develop andtrackpackaging andassemblycomponentspecificationsas well as inventory.

• Audit/regularly visit our contract Manufacturers and suppliers then provide reports.

• Writetechnical reports and present results to internal and external stakeholders.

• Build and grow the Operation Process Team worldwide.

Reliability Testing, Mechanical Engineering, Physics, Process Engineering, Automation, Machine Tool, Software Development, Productivity Management, Hardware Development, Cost Control, * Havea mechanicalengineerdegree with relevant experienceonoptical module and/or Lider assembly.

• Minimal requirement is a Master or Ph.D. degree with 3 years of relevant experience.

• Experience or knowledge of opticalsensors. optical device packaging process, or optical module assembly process.

• Experience with assembly process integration for process flow design and continue process improvement.

• Expertisemechanical drawingsusingSolidWork, mechanical simulation, and thermal simulation.

• Project management capability/experience isa must.

• Experience working with foundries, OSATs, assemblyhouses, PCBAfab, and contract manufacturers in process development and yield improvement is important.

• The abilityto work independently and take ownership of projects as well as collaboratively in cross-functional teamsis a must.

• A fastlearner isa must.

• Good workethics isa must

• Capableofkeeping company confidential information and IP is a must.

Preferred Qualifications

• Knowledge or work experience withPCBAis highly desirable.

• Former experience of microelectronic and optical devices packaging isdesired.

• Understanding Silicon Photonics is a plus.

• Experience with FMEA, failure analysis, and 8D report is highly desired.

• Supplier quality management experience is a plus.

• Knowledge of Lidar and relevant technologies is a plus.

• Former experience of writing technical SoW is a plus.

• Familiar with ECN,PCN,and documentationishighly desirable.

• Competitive salary and equity
• Comprehensive medical, dental, and vision coverage
• 401(k) retirement plan
• Flexible vacation and time-off policy
• Collaborative, fast-paced, and inclusive work environment
• Opportunity to work on cutting-edge technologies with a highly cross-functional team