Intel Process Integration Engineer - (BE) in Hillsboro Job, Engineering Career, Full Time Jobs in Network

*Candidate must possess a PhD degree in one of these fields: Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering, Mechanical Engineering, or related discipline.

*Candidate must possess at least one of the following: 6+ months experience on one or more of the following areas: o Semiconductor device fabrication or nanotechnology. o Electrical characterization of transistors or other semiconductor devices. o Clean room process development.

Preferred Qualifications:

• JMP, MATLAB, Scripting languages (1.e. Python, JSL, TCL), or programming languages (1.e. SQL, C/C++).
• Strong understanding of Device physics (CMOS, FinFET, GAA, etc)
• Hand on experience in VLSI device fabrication and testing in the lab.
• Knowledge of basic VLSI fabrication instruments (1.e. mechanism of dry etcher, ALD (atomic layer deposition), PE CVD, metallization, etc.)
• Understanding statistical process control and charting methodology data flow and integrity. Strong data analysis and presentation acumen.
• Integrated process knowledge, including strong design of experiments and model-based problem-solving skills for complex problems, excursions, and defects.
• Knowledge of automation and defect classification systems in a fab environment.
• Strong stakeholder management and influencing skills. Experience in coordination with other departments, co-workers, etc.

Job Description Join Intel and build a better tomorrow. What we do: The Intel Foundry MDCE and Logic Technology development (LTD) organizations delivers process technology innovation to drive Intel’s product roadmap. What we offer: * We give you opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth. * As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. * We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation). * We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work. * We give you opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth. Benefits: We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative rewards that make Intel a Great Place to Work. Find more information about our amazing benefits here. The ideal candidate should exhibit behavioral traits that indicate: Job Responsibilities include but are not limited to: 1. Process Flow Development * Develop and define integrated process flows for interconnect modules. * Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, dielectric, and metrology teams. * Optimize RC (resistance-capacitance) performance. * Establish process windows and integration schemes. 2. Yield and Defect Reduction * Identify BE-driven yield loss mechanisms such as open and short defects, metal voids, low k ILD damage, etc. * Perform root cause analysis using statistical tools (SPC, DOE, FMEA). * Drive corrective actions to improve yield and cycle time. 3. Process Control and Monitoring * Implement control plans and process monitoring strategies. * Use statistical tools such as: Cpk / Ppk, Control charts, Capability analysis 4. Reliability * Ensure margins for electromigration, stress migration, TDDB, time dependent via degradation. * Evaluate impact of process window shifts on reliability. 5. Technology Transfer * Support ramp from RnD to high-volume manufacturing (HVM). * Document process specifications and standard operating procedures (SOPs). 6. Cross-Functional Collaboration/Work with * Device Engineering * Equipment Engineering/Module Engineering * Yield Engineering * Reliability Teams * Design Teams