Mechanical Engineer ( AI & Data Center Optical Modules)

We are seeking Mechanical Engineers to support the design and development of next-generation high-speed optical modules for AI and data center interconnect applications. This role focuses on advanced mechanical and thermal packaging solutions for high-density, high-power optical modules, including pluggable form factors and emerging advanced packaging architectures., * Design and develop mechanical packaging solutions for high-speed optical modules used in AI and data center interconnect systems

• Drive mechanical concepts from architecture definition through detailed design, prototype build, validation, and production ramp
• Develop detailed 3D CAD models and engineering documentation
• Perform advanced thermal and mechanical stress analysis (FEA) to address high power density, airflow constraints, and long-term reliability
• Own GD&T definition and tolerance stack-up analysis for high-density opto-electro-mechanical assemblies
• Design fixtures, tooling, and test infrastructure to support optical alignment, module validation, and scalable manufacturing
• Collaborate closely with optical, electrical, thermal, reliability, manufacturing, and supply-chain teams to deliver integrated, system-aware solutions
• For senior-level engineers: provide technical direction, review designs, mentor junior engineers, and influence mechanical and thermal platform strategy

• B.S. in Mechanical Engineering or a related discipline (M.S. or Ph.D. preferred)
• Experience level flexible: typically 5+ years of relevant industry experience for senior-level consideration; motivated early-career engineers with strong fundamentals and relevant project experience are also encouraged to apply
• Prior experience developing optoelectronic or high-speed electronic products for data center, AI, or high-performance computing applications is highly valued
• Strong proficiency in mechanical design and thermal simulation tools such as SolidWorks, FloTHERM, or equivalent CAD/FEA platforms
• Deep understanding of thermal management, structural analysis, and high-density packaging design
• Experience with GD&T and tolerance stack-up analysis for complex assemblies
• Familiarity with high-density, non-hermetic optical module packaging and design for manufacturability (DFM/DFA)
• Working knowledge of data analysis tools (e.g., JMP) and basic scripting or programming (VB, C, MATLAB, etc.) to support testing and automation is a plus
• Ability to operate independently on complex technical problems while contributing effectively in a highly cross-functional environment

Additional Information

• Self-motivated and adaptable in a fast-paced R&D and NPI environment
• Willingness to travel internationally (up to 25%) to manufacturing and contract manufacturing sites to drive NPI execution, manufacturing readiness, yield improvement, and high-volume production ramp