Datacenter Power Supply Architecture Expert

Lead Power Integrations’ Datacenter Business Unit, owning full P&L responsibility and end-to-end strategy across one of the company’s highest-growth markets. This role combines market leadership, product definition, and engineering execution to build a scalable business in AI infrastructure, hyperscale datacenters, and high-performance compute platforms. The BU integrates segment strategy, New Product Definition (NPD), and engineering execution to accelerate Power Integrations’ penetration into next-generation power architectures and compute platforms.

Business Ownership & Performance

• Own full BU P&L including revenue growth, gross margin, and design-win pipeline.
• Define pricing strategy, product mix, and long-term business model.
• Build and manage multi-year revenue plans aligned to datacenter and AI infrastructure growth.
• Drive accountability for design wins, production ramps, and customer adoption.
• Analyze market dynamics, competitive positioning, and pricing models to inform business decisions.

Core Responsibilities

Business Unit Leadership

• Define and lead the Datacenter & Compute segment strategy.
• Own the BU’s growth plan, design-win pipeline, and market expansion initiatives.
• Build deep executive-level relationships with hyperscalers, server OEMs/ODMs, and ecosystem partners.
• Translate market trends and customer architectures into clear product and investment priorities.
• Identify and prioritize lighthouse customer opportunities.

Integrated Product & Engineering Leadership

• Lead the BU’s dedicated IC design and system engineering teams.
• Drive tight alignment between market requirements, system architecture, and silicon implementation.
• Oversee development from concept through product introduction and customer deployment.

• Drive innovation in: *

• GaN-based power architectures
• High-frequency switching platforms
• Digital control and system-level optimization
• 48V and emerging datacenter power architectures

New Product Definition (NPD) & System Applications

• Lead the NPD / System Applications team responsible for defining next-generation power solutions.
• Translate customer system architectures into clear product definitions and technical requirements.
• Develop reference architectures and system-level design approaches that guide product development.
• Partner closely with applications teams and customers to validate system performance and requirements.

Customer & Market Engagement

• Own executive-level relationships with hyperscalers, server OEMs/ODMs, and infrastructure partners.
• Represent Power Integrations in strategic discussions on future power architectures and industry trends.
• Serve as the voice of the customer within the organization, ensuring roadmap alignment with real-world needs.

Cross-Functional Alignment & Execution

• Partner with Product & Technology leadership to align BU initiatives with platform roadmaps.
• Coordinate with Go-To-Market Enablement to ensure strong launch support, field readiness, and ecosystem engagement.
• Lead cross-functional execution across engineering, operations, sales, marketing, and quality.

Operating Leadership

• Establish a clear operating cadence across the BU, including: *

• Design win tracking and pipeline management
• Product milestone reviews
• Customer engagement cadence
• Revenue forecasting and accountability
• Drive a culture of execution, accountability, and continuous improvement.

Do you have experience in Technology management?, * 15+ years of experience in power semiconductors, power electronics, or datacenter infrastructure.

• Proven ownership of P&L or equivalent business responsibility, including revenue growth, margin management, and design-win accountability.

• Deep expertise in: *

• Server and datacenter power architectures
• AI / hyperscale infrastructure trends
• High-density and high-efficiency power conversion
• Strong experience with hyperscalers, server OEMs/ODMs, or cloud infrastructure providers.
• Background in GaN, SiC, digital power, or advanced packaging technologies.
• Familiarity with emerging industry standards such as 48V architectures and OCP initiatives.
• Experience leading integrated teams across product management, applications engineering, and IC design.
• Proven track record of winning and scaling business with Tier 1 customers.
• Strong executive presence with the ability to engage senior customer stakeholders and internal leadership.
• Demonstrated ability to operate in a global environment and lead distributed teams.