Staff Equipment Development Engineer - Advanced...
Role details
Job location
Tech stack
Job description
As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will develop and optimize next-generation, first-of-a-kind (FAOK) wafer and die equipment. You will take ideas from conception through development to implementation in APTD and manufacturing facilities. Responsibilities include identifying, diagnosing, and resolving equipment-related problems using failure analysis, FMEA, 8D, or FDC/Data Science methodology. You will also coordinate and carry out equipment evaluation/optimization, lead improvement and cost reduction activities, and interact with process development, manufacturing, and equipment vendors to ensure robust processes. You will become a domain expert, crafting technology roadmaps and influencing Micron's leadership in semiconductor manufacturing.
Responsibilities:
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Develop strategies and implement to improve Equipment maturity for (FOAK) hardware.
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Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing. Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron's products.
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Optimizing equipment to reduce cost, increase availability, and improve hardware and process capability.
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Collaborating with process development teams to develop innovative new solutions.
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Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions.
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Performing fundamental research to drive innovative solutions for next-generation equipment products.
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Support equipment transfer to production facilities (some domestic or international travel may be required).
Requirements
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Master's Degree or equivalent experience in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
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2+ years of semiconductor process or equipment engineering experience
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Fundamental understanding of post probe and assembly process and equipment interactions.
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Understanding of related inline/electrical/probe failure.
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2+ years of experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis
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Ability to resolve sophisticated issues through root-cause or model-based problem solving and a focus on meeting commitments
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Hands on experience with wafer / assembly tools and overlay systems
Preferred Qualifications:
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Ph.D. in Mechanical Engineering, Chemical Engineering, Electrical Engineering, or a related technical field, or equivalent experience
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Knowledge of robotics, machine logic language, or new hardware design is desirable.
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Wafer or die bonding, plating, warpage control and packaging field experience preferable.