Application Engineer

• Use DISCO equipment to prototype, optimize, and troubleshoot precision processes in the areas of device grinding or singulation. Characterize processing results. Draw conclusions based on processing data. Deliver singulation or grinding processes that can be integrated into semiconductor fabrication process flows.
• Design and perform grinding or singulation experiments for various materials based on input from DISCO's clients, such as, semiconductor wafers, electronic packages, or medical device components. Understand DISCO equipment instrumentations during processing. Concisely summarize and analyze results, and compile technical documentation reports
• Troubleshoot complex challenges with limited supervision. Perform Root Cause Analyses to achieve fundamental understanding on defects, resulting in innovative solutions.
• Generate technical reports, process documentations, operating procedures, and high-level summary presentations to the management
• Become a reliable consulting resource for customers. Interact with customers to understand overall fabrication integration, process control methodologies, and gain insights to product roadmaps
• Prototype new equipment hardware or software components for internal learning
• Participate and contribute to DISCO corporate activities focusing on continuous improvement, deeper thinking, and value exchange.
• Perform additional tasks as assigned.

• Bachelor of Science degree in engineering, physical sciences, industrial operations or relevant work experience
• General computer programming. Proficiency with Windows PC
• Business communication. Technical writing and presentation skills
• Materials science; solid state physics; semiconductor wafer fab processing experience
• Ability to handle fragile materials
• Comfortable standing and working in a lab or cleanroom environment
• Able to run statistical analysis
• High-level software/programming knowledge; C/C++/C#; SQL/Python; CAD is a plus
• Japanese language skill is a plus., * Role involves a combination of remaining in a stationary position and moving about for extended periods.
• May require bending, stooping, and working in varied physical positions to access hard to reach areas on equipment.
• Lift and carry or otherwise move at least 30lbs.
• Wear personal protective gear for extended periods and use proper safety procedure when working with delicate materials, hazardous chemicals, moving mechanical parts, etc.

Interpersonal Skills:

• Clear, concise, and effective communication skills to interact with colleagues, customers, and leadership.
• A high degree of self-motivation and creativity, with the ability to perform under pressure, even in challenging situations.
• A natural ability to build strong relationships, maintaining trust and teamwork within a global company, building upon DISCO's culture to help build an inclusive work environment.
• Willingness to lead peers on projects and act as a resource for colleagues.

This is a full-time position with benefits including Bonuses, Insurance (Medical, Dental, Vision, Life), Health Savings Account, 401(k), Paid Time Off, Paid Holidays.

"Always the Best, Always Fun!" DISCO Corporation is a global powerhouse in precision cutting, grinding, and polishing solutions, with a reputation for excellence across the semiconductor, medical devices, and electronic component industries. Headquartered in Tokyo, Japan, we are a forward-thinking company with a strong presence in 60+ locations worldwide with a diverse team of 7,000+ employees. Our success is driven by our core DISCO values that emphasize trust, continuous innovation, and an unwavering commitment to quality. At DISCO, we pride ourselves on fostering an inclusive culture where employees thrive, grow, and contribute to shaping the future of technology. DISCO Corporation's U.S affiliate, DISCO Hi-Tec America, Inc. (DHA), is looking to expand our Technical Services team! We are currently people who bring fresh perspectives, new ideas, and unique skills to join us as a Process Application Engineer in our San Jose, CA office., DISCO Hi-Tec America, Inc. is committed to Equal Employment Opportunity and diversity in its workforce without discrimination