Lead Solutions Engineer - Runset Enablement (Physical Verification)

Cadence is seeking a Lead Solutions Engineer specializing in runset enablement to support advanced semiconductor technologies. This role is critical to the timely delivery of physical verification solutions and provides full-time coverage in the U.S. time zone. The position emphasizes deep technical execution, problem-solving, and close collaboration with customers and internal engineering teams.

As a Lead Solutions Engineer, you will focus on hands-on development and validation of Pegasus DRC and LVS runsets, enable adoption through automation and best practices, and contribute directly to high-quality solution delivery for advanced process nodes.

Key Responsibilities

• Drive hands-on development and validation of Pegasus DRC and LVS runsets for advanced semiconductor nodes.
• Design, enhance, and maintain automation frameworks for regression execution, issue detection, and validation reporting.
• Collaborate closely with R&D and cross-functional teams to debug issues, validate fixes, and improve solution quality and performance.
• Provide technical enablement and support to customers on tool usage and advanced physical verification methodologies.
• Apply and help refine best practices for runset development, validation, and quality assurance.
• Work independently on complex technical deliverables while contributing knowledge and guidance within the team.
• Partner with internal teams to support predictable and timely delivery of physical verification solutions.

• MS degree with 5+ years of experience or PhD with 3+ years in Electrical Engineering, Computer Science, or related field.
• Strong understanding of semiconductor design flows and physical verification methodologies.

Experience and Technical Skills

• Proven hands-on experience developing and validating DRC and LVS runsets using Pegasus or comparable tools such as Calibre, ICV, or Assura.
• Experience building or maintaining automation for regression, validation, and reporting.
• Proficiency in TCL, Python, and/or Perl, with experience in Linux/Unix environments.
• Solid understanding of advanced process technologies and verification methodologies (e.g., ground rules, fill, ESD).
• Familiarity with chip fabrication processes and advanced-node challenges, including multi-die designs.
• Nice-to-have: Experience with PERC and Fill runsets.

Professional Skills

• Strong hands-on problem-solving and technical execution skills.
• Clear written and verbal communication skills for technical and customer interactions.
• Ability to collaborate effectively across cross-functional and global teams.
• Comfortable taking ownership of technical tasks and driving them to completion.
• High integrity and a collaborative, team-oriented working style.

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