Module Integration Engineer

Seeking a senior individual contributor with hands on experience in module process integration for advanced Gate All Around (GAA) technologies. The Module Integration Engineering (MIE) team drives new technology transfer, establishes process integration route, and enhances process margin, performance, yield, and reliability. In this role you will perform 2 nm GAA source & Drain (SD) module integration projects, working closely with Process Architect (PA), Process Integration Engineering (PIE), Fab Engineering (FE) units, Device & SRAM integration, DFM, and manufacturing teams.

Role and Responsibilities

Here's What You'll Be Responsible For:

• Execute the Front End of Line (FEOL) module setup plan-particularly the Source & Drain (SD) module-with minimal supervision to meet the aggressive qualification timeline.
• Monitor line performance, intervene on off target SPC excursions, and develop improvement plans that satisfy process capabilities.
• Lead engineering projects that drive high volume manufacturing (HVM) product qualification, yield ramp-up, and performance target achievement.
• Lead Task Force Teams (TFTs) to resolve systematic yield, performance, or reliability challenges.
• Perform feasibility studies and create design of experiments (DOE) for performance and yield improvement throughout the product development cycle.
• Produce written reports and deliver oral presentations for internal management and external partners.

• Master's or PhD degree in Electrical Engineering, Physics, Materials Science, or a closely related field.
• Minimum 8 years of experience on advanced node FinFet or GAA technology.
• Front End of Line (FEOL) module process integration engineering experience. Strong preference for Gate-All-Around (GAA) Source & Drain module integration engineering experience.
• Device physics knowledge with hands-on work in FinFET or Gate-All-Around (GAA) devices.
• Knowledge of unit processes such as: lithography, dry / wet etch, CMP, diffusion, implant, thin-film deposition, and metrology.
• Expertise in Design of Experiments (DOE), and experience in Data analyses software (ex: JMP, Spotfire, etc.)
• Experience leading projects and/or serving as a Task Force Team (TFT) lead.
• Capable of shifting focus and changing priorities and ability to meet deadlines multiple priorities.
• Interpersonal skills with the ability to influence, motivate, and align diverse stakeholders.
• Excellent written and verbal communication skills.
• Willing to work and learn in a fast-paced, cross-functional, multicultural team environment.

The current base salary range for this role is between $106,000 - $206,000. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.

Total Rewards At Samsung SAS, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.

We offer a comprehensive benefits package, including:

• Medical, dental, and vision insurance
• Life insurance and 401(k) matching with immediate vesting
• Onsite café(s) and workout facilities
• Paid maternity and paternity leave
• Paid time off (PTO) + 2 personal holidays and 10 regular holidays
• Wellness incentives and MORE

Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.

All positions at SAS are full-time on-site.

Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At SAS, we are Innovating Today to Power the Devices of Tomorrow.