Microelectronics Applications Engineering Manager
Role details
Job location
Tech stack
Job description
Because of the need for consistent, in-person collaboration and/or the requirement to perform all work onsite due to the nature of this particular role, it will be performed full-time on site. This means work will be conducted on location at a BAE Systems facility 100% of the time., The Technical Manager will oversee a team of applications engineers supporting customer design-in, integration, validation, and deployment of microelectronic products, including ICs, multi-chip modules (MCMs) and system-in-package (SiP) solutions. This leader will drive technical excellence, customer satisfaction, and revenue growth through effective team management and strategic alignment with product and business objectives., + Establish best practices for customer engagement, issue resolution, and documentation.
Technical Oversight
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Oversee development of:
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Reference designs
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Application notes
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Design guidelines
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Validation reports
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Contribute to structured product validation methodologies.
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Support root-cause investigations and corrective action plans for field issues.
Customer & Business Engagement
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Partner with the Microelectronics Product Line to support key customer accounts and strategic design-ins.
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Participate in high-level customer meetings to define requirements and communicate technical roadmaps.
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Translate customer system requirements into actionable feedback for R&D and product management.
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Support revenue growth through strong technical positioning and competitive differentiation.
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Improve customer satisfaction and reduce time-to-ramp.
Cross-Functional Collaboration
- Work closely with
Requirements
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Bachelor s or Master s degree in Electrical Engineering or related field (MSEE preferred).
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8 years of experience in semiconductor applications engineering, hardware design, or system engineering.
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3 years of experience in a technical leadership or managerial role.
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Knowledge of:
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RF, Analog and digital circuit design
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High-speed interfaces (e.g., PCIe, DDR, SERDES, Ethernet)
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Hands-on experience with lab characterization and debugging.
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Demonstrated experience working directly with strategic customers.
Preferred Education, Experience, & Skills
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Experience with advanced packaging (SiP, 2.5D/3D integration, chiplets).
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Familiarity with reliability standards (JEDEC, AEC-Q100, MIL-STD).
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Experience in automotive, aerospace & defense, communications, or data center markets.
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Strong business acumen and understanding of product lifecycle management.
Benefits & conditions
Full-Time Salary Range: $132962 - $226035
Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience.
Employee Benefits: At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being. Regular employees scheduled to work 20 hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance. Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave. Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards. Other incentives may be available based on position level and/or job specifics.