Software Automation Systems Engineer

As a member of the software automation engineering team, you will be responsible to investigate, define, and implement tooling and automation solutions used in our semiconductor fabs. These solutions should be developed with a larger HP Inc. worldwide fab strategy to enable scalability of solutions.

Tasks typically include:

• Developing software solutions for semiconductor equipment, related software tools, fab process improvement efforts, and overall system support.
• Utilize analytical skills to develop software/hardware integrated system specifications, gather customer requirements, and create innovative solutions.
• Participating in projects and teams effectively across departments and organizations to develop, implement, and consult on factory automation solutions.
• Maintain expertise and practical knowledge of customer's business and system needs as they evolve.
• System debugging and troubleshooting, qualifications and testing, design characterization, and release to production.
• Participate with worldwide partners and vendors to ensure good communication and documentation for all aspects of the design.
• Occasional travel and participation to support prototype and production operations or customer installations during off-hours may be required.

• B.S. or M.S. in Computer Science, Computer Engineering, or related engineering degree.
• Fluency in English language.
• 1+ years of relevant experience.
• Ability to solve technical problems in a fast-paced product development environment.
• Agile software development knowledge and understanding.
• Knowledge and use of object-oriented programming.
• Understanding of software development lifecycle from conception through obsolescence.
• Ability to work and interact effectively with team members and individuals from other disciplines, projects, organizations, divisions, and companies.
• Demonstrated leadership, teamwork, interpersonal communication, and analytical/technical skills.

Desired Qualifications:

• Knowledge of JAVA, JAVA Swing, Python, and C# programming.
• Knowledge of semiconductor fab and discrete assembly manufacturing.
• SEMI standards, GEM, SECS2.
• Automated tool programming and real-time control.
• AWS development knowledge and experience.
• Tibco Rendezvous and Systema Client/Server Framework.
• Understanding of message bus functionality.
• Database experience.
• IOT experience.
• PC hardware and software in support of tool and test equipment development.

The pay range for this role is $83,000 to $127,800 USD annually with additional, HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including;
• 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave (US benefits overview

[https://hpbenefits.ce.alight.com/])