Software Development and AI for Chip Package Board Codesign iv)

• Develop and support software solutions for comprehensive chip-package-board co-design workflows and methodologies
• Translate co-design and design methodology needs into high-quality code, ensuring robustness, scalability and speed across chip, package,and board design environments
• Develop and deploy AI/ML based software to enhance design andverification efficiency
• Optimize and refactor existing in-house software modules, applying modern software best practices
• Build intelligent data pipelines to collect and analyze design andsimulation results, enabling data-driven decisions
• Bridge the gap between software and EDA tools by utilizing advanced APIs and scripting interfaces

Your Profile

You remain aware of the big picture even in complex situations and takedecisions despite uncertain circumstances. You have the passion and thecourage to develop new and creative ideas and beside you are inspiringothers for your ideas and explain even complex issues in a clear andconvincing manner. On top, you respect different attitudes and points ofview and use the creative potential they offer.

• A degree in Computer Science, Data Science, Electrical Engineering or a similar technical field
• Minimum 2 years of experience in software development, with a strong portfolio in automation or tool development
• Expert-level proficiency in Python and experience with libraries fordata science and AI (e.g., Pandas, Scikit-Learn, PyTorch, or TensorFlow)
• A strong interest in "Hardware-Aware" software development, understanding how code interacts with physical design constraints, system integration flows, and design tools
• Experience in Linux environments, including shell scripting and handling large-scale data sets in compute farm infrastructures
• Basic knowledge of EDA workflows and exposure to specialized languages like Cadence Skill or Keysight AEL/Python is of advantage
• A customer-oriented mindset with the ambition to solve technical problems for internal customers
• Fluent English skills, German skills are a big plus

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problemsolvers behind tomorrow's technology. Being responsible for Software Development and AI for Chip Package Board Codesign on our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?, This position is subject to the collective agreement for workers and employees in the electrical and electronics industry, at least employment group G (https://www.feei.at/leistungen/informations-service/mindestlohne-und-gehalter). The monthly salary is paid 14 times p.a. A higher payment is negotiable depending on your expertise and skills. Furthermore, Infineon offers additional employee benefits. Contact: Mag. Stefanie Triebelnig, BA, LinkedIn #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.