IC SoC Product Subsystem Architect

This opening is within the Advanced Chip Engineering (ACE) SoC Organization, a central R&D Design group responsible for end-to-end IC/SoC implementation of the Automotive and Industrial Automation Processors in NXP., * Architecture and spec definition of subsystem/IP components and/or top-level IC SoC products, split into hardware building blocks, requirements and interfaces

• Development of digital signal processing algorithms and hardware IP design in Verilog / VHDL
• Area / power estimation and optimization
• Support of FPGA, Verification (pre-silicon) and Validation (post-silicon) activities
• Technical lead for a team of hardware developers during product development, including resolution of most complex problems.
• RTL design, implementation and integration of different IPs and subsystems
• Quality checks using EDA tools
• Usage and creation of IA/ML Agents that improve our flows, efficiency and methodologies
• Research and feasibility studies to determine product roadmaps and technical ways forward
• Support in innovation projects and test chip development
• Close collaboration with Verification, Design, DFT and Physical design teams across the world

• Strong team leadership skills desirable to be able to lead a technical team
• Advanced knowledge of digital circuit design incl. FPGA design and verification
• Basic RFCMOS circuit design knowledge
• In-depth digital signal processing know-how
• Basic knowledge of embedded compute cores like Arm Cortex family
• Basic knowledge of digital signal and vector processor cores
• Hands-on experience in requirements engineering and related tools
• In-depth knowledge of the semiconductor industry and technologies
• At least basic knowledge of automotive safety related procedures
• Further growth into system-on-chip architect role desired
• Proven experience with automation using several programming and scripting languages
• Fluent written and verbal communication in English

Key Soft Skills

• Team player capable to work in multi-national teams demonstrating strong engagement and contribution
• Proficient skills in both written and verbal communication. Can articulate well
• Can demonstrate emotional intelligence and ability to work well as a part of local and international teams, * Master of Science in Electrical or Electronics Engineering
• At least 5-10 years of industry experience
• 2+ years of experience in hardware architecture design for system-on-chip / embedded systems

Please note: The successful candidate may/will be responsible for security related tasks. The assignment may/will be in scope of security certifications, therefore a conscious and reliable way of working is necessary

As part of the Microprocessor SoC Implementation ACE R&D team in NXP, the product development of a large significant portion of NXP roadmap comes out of this organization and, consequently, there is remarkable visibility to the Corporate NXP Management team. The candidate would be integrated in a team based in Hamburg, Germany and with day-to-day interactions with other design teams based locally or abroad. Our team has a track record of more than 20 years of successful product designs and innovation.