Team Lead Test Engineering - Die Bonder Software

As Team Lead Test Engineering, you take end-to-end ownership of the test strategy for our Die Bonder software. You ensure that manual and automated testing work together effectively as part of a comprehensive quality approach.

In this key role, you collaborate closely with development, system engineering, and other stakeholders. You act as a product-oriented quality expert for highly specialized semiconductor equipment, working closely with the machine, production workflows, and customer expectations.

Own and continuously improve the overall test strategy and quality approach Plan, coordinate, and track testing activities across local and distributed teams Perform hands-on testing on real equipment (system, regression, and acceptance testing) Ensure effective alignment of manual and automated testing Analyze defects, assess risks, and support release readiness decisions Maintain structured test documentation, reporting, and status communication Drive continuous improvement of test processes and collaboration

Degree in Engineering, Computer Science, Mechatronics, or a related field Several years of experience (approx. 5+ years) in software or system testing in complex technical environments Strong experience in test planning, coordination, and execution Solid understanding of manual and automated testing within structured quality processes Analytical, structured, and independent working style Strong communication and coordination skills in cross-functional teams Hands-on mindset and willingness to work directly with equipment Very good English skills; good German skills Nice to have: Experience with Jira, Bitbucket, AIO, Gherkin, Python

We offer attractive and challenging work in a dynamic, team-oriented and highly innovative company. You will be working in a highly qualified team with an individually adjustable flexitime model and social benefits and numerous opportunities for professional and personal development.

Besi is a leader in the research and development and production of high-end chip placement machines, with R&D, production and sales offices around the world. We support the semiconductor industry with know-how and equipment to advance 5G broadband technologies, autonomous driving, artificial intelligence (AI), high-performance computing and more.

Besi Austria was founded in 1986 and has been part of the Dutch Besi Group since 2005. Our company, one of Besi´s R&D facilities is located in Radfeld, Tyrol, where we have employees from over 25 nations. Your areas of impact