Reliability Engineer

IC Resources
Valencia, Spain
about 1 month ago

Role details

Contract type
Permanent contract
Employment type
Full-time (> 32 hours)
Experience required
3 years minimum
Working hours
Regular working hours

Tech stack

Failure Mode Effects Analysis Minitab Reliability Engineering JMP (Statistical Software) Statistics Packages

Job description

My client is looking for a Reliability Engineer to support reliability strategy across the product line. You will lead qualification activities for Photonic networking products, and work with design, process and packaging teams to improve product performance., * Design, plan and execute reliability qualification programmes for integrated photonic products

  • Integrate design for reliability into new product development cycles
  • Conduct FMEA to identify and reduce reliability risks
  • Perform root cause failure analysis and drive corrective actions
  • Establish internal reliability standards aligned with customer and industry requirements
  • Use statistical tools to model reliability performance and predict lifetimes
  • Prepare qualification plans, risk assessments and reliability reports
  • Identify mechanical and material risks and drive upstream design improvements
  • Communicate findings across engineering teams, suppliers and customers

Requirements

  • Bachelor’s degree or higher in electrical engineering, materials science, physics or related field
  • Minimum three years experience in reliability engineering within semiconductor or photonics industries
  • Knowledge of device and package reliability methodologies including Telcordia and JEDEC
  • Understanding of device physics and failure mechanisms in SerDes, digital and mixed signal ICs
  • Experience using SEM, EDX, FIB, EMMI, OBIRCH and related FA tools
  • Knowledge of packaging failure mechanisms such as solder joints, warpage and metal migration
  • Experience with reliability modelling and statistical tools including Weibull, Minitab or JMP
  • Familiarity with advanced packaging technologies including flip chip, wafer level packaging and 3D integration

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