System Test HW Engineer, Amazon LEO

Experteer Overview In this role you will design and validate PCB hardware for MODEM SOC development, enabling rapid tape-out-to-orbit progress. You’ll work on cross-functional teams to translate silicon requirements into robust board solutions for pre- and post-silicon validation. You will drive high-speed, space-grade PCB design and bring-up on development platforms that support firmware and software drivers. This is a hands-on position at the intersection of ASIC, firmware, and hardware engineering with a key impact on mission readiness. Compensation / Benefits * Design, optimize, and develop PCB schematics and layouts for SOC validation and SW development platforms (Siemens Xpedition) * Define board requirements with post-silicon engineers, including debug access, instrumentation taps, and high-speed interface breakout (SerDes, DDR, Ethernet SGMII/RGMII) * Ensure boards meet early SW bring-up and driver development needs in collaboration with firmware/software teams * Translate silicon requirements into board-level implementations with cross-functional teams (ASIC, firmware, mechanical) * Review signal integrity and power integrity analyses and incorporate recommendations into layouts * Own the board lifecycle from concept through fabrication, assembly, bring-up, and ECO management Tasks * Bachelor’s degree in Electrical Engineering or related field * 5+ years of multi-layer PCB design (8+ layers) for mixed-signal systems * Proficiency in Siemens Xpedition for schematic capture and layout * Experience with high-speed digital interfaces: DDR, SerDes, Ethernet (SGMII, RGMII) * Working knowledge of low-speed protocols: I2C, SPI, I3C * Understanding of impedance-controlled routing and high-speed PCB design best practices * Experience with PCB fabrication, assembly processes, and lab bring-up Key requirements * health insurance (medical, dental, vision, prescription) * 401(k) matching * paid time off * parential leave * RSUs and sign-on payments * flexible spending accounts

will requirements into board-level implementations with cross-functional teams (ASIC, firmware, mechanical) * Review signal integrity and power integrity analyses and incorporate recommendations into layouts * Own the board lifecycle from concept through fabrication, assembly, bring-up, and ECO management Tasks * Bachelor’s degree in Electrical Engineering or related field * 5+ years of multi-layer PCB design (8+ layers) for mixed-signal systems * Proficiency in Siemens Xpedition for schematic capture and layout * Experience with high-speed digital interfaces: DDR, SerDes, Ethernet (SGMII, RGMII) * Working knowledge of low-speed protocols: I2C, SPI, I3C * Understanding of impedance-controlled routing and high-speed PCB design best practices * Experience with PCB fabrication, assembly processes, and lab bring-up Key requirements * health insurance (medical, dental, vision, prescription) * 401(k) matching * paid time off * parential leave * RSUs and sign-on payments * flexible spending accounts