3D-IC Application Engineer

Experteer Overview As an Applications Engineer with Siemens EDA Technology Solutions Sales, you will support consultative sales efforts for leading semiconductor and electronics manufacturers, aiming to secure technical design wins for Siemens EDA products and services. You will deliver technical presentations, demos, and benchmarks, and help architect 3DIC flows and integration scripts. You’ll collaborate globally to advance solutions and drive market-share gains, with domestic and international travel as needed. Compensation / Benefits * Support consultative sales efforts and secure technical design wins for Siemens EDA offerings * Deliver technical presentations, product demonstrations, and benchmarks * Develop and propose solutions and account strategies to grow market share * Architect and prototype emerging 3DIC solutions through flows and integration scripts * Coordinate with global peers and stakeholders to align on status and strategy * Travel domestically and internationally to engage customers and opportunities Tasks * MSEE/BSEE with 4+ years of design experience * Significant experience in advanced IC package layout design and/or interposer layout design * Experience with IC design is a plus * Knowledge of IC package design tools (Cadence APD/SiP, Siemens Xpedition/i3DL) * Familiarity with package/interposer planning tools (XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler) * Familiarity with 2.5D/3D chiplet-based design (e.g., TSMC InFO, CoWoS, Foveros) * Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS) * Familiarity with signal/power integrity tools (HyperLynx, Sigrity, SIWave, ADS) and related flows * Experience with Siemens Calibre DRC/LVS and 3DSTACK is highly desirable * Proficiency with Microsoft Word, Excel, PowerPoint * Scripting/programming: VBS, Python, Tcl, Perl * Working OS knowledge of Windows and Linux * Prior experience as an Applications Engineer is preferred Key requirements * health and wellness benefits * hybrid work model (home/office) * opportunities to work with a global team * competitive pay range and incentive plan * diverse and inclusive workplace * global impact in a world-leading software company

to engage customers and opportunities Tasks * MSEE/BSEE with 4+ years of design experience * Significant experience in advanced IC package layout design and/or interposer layout design * Experience with IC design is a plus * Knowledge of IC package design tools (Cadence APD/SiP, Siemens Xpedition/i3DL) * Familiarity with package/interposer planning tools (XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler) * Familiarity with 2.5D/3D chiplet-based design (e.g., TSMC InFO, CoWoS, Foveros) * Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS) * Familiarity with signal/power integrity tools (HyperLynx, Sigrity, SIWave, ADS) and related flows * Experience with Siemens Calibre DRC/LVS and 3DSTACK is highly desirable * Proficiency with Microsoft Word, Excel, PowerPoint * Scripting/programming: VBS, Python, Tcl, Perl * Working OS knowledge of Windows and Linux * Prior experience as an Applications Engineer is preferred Key requirements * health and wellness benefits * hybrid work model (home/office) * opportunities to work with a global team * competitive pay range and incentive plan * diverse and inclusive workplace * global impact in a world-leading software company