Sr Staff Integration Engineer
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Role details
Tech stack
Job description
TheSr. Staff Integration Engineeris responsible fordefining,optimizing, and sustaining end-to-end process integration flows for probe card manufacturing in a high-volume semiconductor environment. This role serves as a senior technical authority, integrating complex unit processes across wafer-level fabrication, MEMS, precision assembly, interconnect, and electrical test.
The position drives yield performance, manufacturability, and scalability by aligning cross-functional engineering, operations, and product teams. The roleoperateswith significant autonomy, leading cross-module problem solving, technology transfer, and continuous improvement initiatives, while mentoring engineers and influencing integration strategy across sites.
This role acts as the primary technical interface between process modules, ensuring integrated process flows meet product, quality, and reliability requirements., Assembly & Test Integration Leadership
- Own integration strategy across all Assembly & Test operations including Solder paste printing, Surface mount technology (SMT), Pick-and-place assembly, reflow soldering, PCB assembly, Underfill and adhesive processes, Mechanical assembly, Alignment and calibration, Electrical verification, and Final product test.
- Define process windows, acceptance criteria, and control plans for critical assembly operations.
- Lead optimization of solder joint reliability, component placement accuracy, reflow profiles, coplanarity, and assembly yield.
- Drive integration improvements between PCB design, assembly processes, probe structures, and final electrical performance.
- Develop assembly flow architectures that support volume scalability, cycle-time reduction, and manufacturability.
- Partner with contract manufacturers and internal assembly operations to ensure process consistency and technology transfer success.
- Analyze assembly-related yield losses including solder defects, placement errors, opens, shorts, warpage, misalignment, and handling damage.
- Establish qualification methodologies for assembly materials, solder alloys, adhesives, PCB technologies, and new assembly equipment.
Process Integration Ownership
- Define, own, and continuously improve end-to-end process integration flows for probe card manufacturing.
- Ensure alignment of unit process performance to product-level electrical, mechanical, and reliability targets.
- Identifyand manage integration risks, interactions, and trade-offs across modules.
Yield & Performance Optimization
- Lead integration-level yield improvement initiatives using data-driven analysis and structured problem solving.
- Investigate complex yield excursions, defect mechanisms, and cross-process interactions.
- Drive defect reduction, process capability improvements, and cycle time reduction.
New Product Introduction (NPI) & Technology Transfer
- Lead integration activities for NPI, pilot builds, and ramp to high-volume manufacturing.
- Own integration readiness criteria including process stability, control plans, and manufacturability.
- Support cross-site technology transfer and process replication with strong change control discipline.
Process Flow Development & Control
- Develop andmaintainintegrated process flows, specifications, and control strategies.
- Define critical process parameters, control points, and monitoring strategies (SPC/FDC).
- Ensure robust process window characterization and documentation.
Data Analysis & Problem Solving
- Analyze inline, electrical test, metrology, and defect data toidentifyintegration gaps.
- Design and execute complex DOEs to resolve multi-variable process interactions.
- Utilize structured methodologies (DMAIC, 8D) for root cause analysis.
Mentorship & Technical Influence
- Mentor and guide junior and senior engineers on integration practices and problem solving.
- Provide technical leadership on cross-functional and multi-site initiatives.
- Influence long-term integration strategy and technology roadmap.
Requirements
| Assembly Manufacturing, Assembly Operations, Assembly Testing, Probe Cards, Process Integration, Process Operations, Product Integration, Semiconductor Device Fabrication, Semiconductor Fabrication, Semiconductor Industry, Semiconductor Manufacturing, Minimum of 12 years of related experience with a Bachelor’s degree; or 8 years and a Master’s degree; or a PhD with 5 years experience; or equivalent experience | Required |
Benefits & conditions
Benefits offered for this role include medical, dental, vision, EAP, short-term and long-term disability, life insurance, flexiblespendingand savings accounts, 401(k),ESPPand paid time off.
About the company
Forming Our Future together
FormFactor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle - from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The company serves customers through its network of facilities in Asia, Europe, and North America.
Rooted in our core values - Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People - we foster an environment where diverse perspectives are not only welcomed but celebrated. Everyone can make an impact here. Whether it’s improving products, supporting customers, or positively influencing peers and the community, the contributions of our people matter.
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