Staff Integration Engineer

• Develop wafer fabrication plans for advanced head devices from concept through component-level feasibility demonstration.
• Work with the design team to translate device concepts into feasible, predictive test structures.
• Lay out wafer build plans, including CAD, process modules, test requirements, and success criteria.
• Coordinate with unit process owners (deposition, lithography, etch, CMP, and wet process) to achieve equipment and process readiness for prototype wafer builds.
• Support wafer supply for critical experiments through wafer starts, daily WIP decisions, and ownership of daily velocity and moves parametrics.
• Ensure built devices meet design intent for geometry, performance, and reliability.
• Detect, pareto, and resolve new defect modes related to process module integration.
• Explore new process techniques to support hardware paths needed for advanced capability and manufacturability.
• Coordinate experiments, projects, and wafer tracking activities to deliver results according to the designated schedule.
• Participate in transfers of promising new technologies to the product development engineering team.
• Contribute to Seagate’s IP portfolio in the form of invention disclosures, patents, trade secrets, peer-reviewed journal articles, and/or white papers., Our Normandale campus spans two suburbs, Edina and Bloomington, and serves as the Recording Head development and manufacturing arm of Seagate. Located in the heart of a bustling community, Seagate offers an on-site cafe, or if you prefer, you can drive to one of many restaurants just minutes away. Need to grab a gift over lunch time? Shopping is abundant in the area. If working out is your thing, the on-site fully equipped fitness center hosts wellness programs, outdoor activities, tournaments and group workouts. Looking for something more laid back? Reset in one of our meditation rooms, or simply take a walk around our indoor walking path. On-site cultural festivals, celebrations and community volunteer opportunities also abound.

• You are self-motivated, intellectually curious, adept at problem solving, and have strong attention to detail.
• You are an honest and respectful team player, capable of working in strong partnership with a diverse global group of engineers and technicians.
• You are a well-organized multitasker who can balance day-to-day wafer processing needs with longer-term development work.
• You are interested in mentoring and collaborating with other engineers while contributing to the success of the broader team.
• You maintain thorough documentation of results and can clearly present and discuss them with engineering and management teams.
• You have a track record of innovation and problem-solving and regularly use external resources (vendors, conferences, and technical literature) to inspire new ideas and directions.
• You are able and eager to work in a mix of cleanroom and laboratory environments.

Your experience includes:

• Bachelor’s Degree in Materials Science, Electrical Engineering, Physics, Applied Physics, Chemistry, or a related science field and 8+ years of experience, or Master’s degree in the same fields and 6+ years of experience, or PhD and 3+ years of experience or equivalent education and experience.
• Strong hands-on experience and understanding of wafer device builds in cleanroom or industrial wafer fabrication environments.
• Experience in device building, including CAD layout, device build flow simulation/visualization, WIP management, and wafer-scale integration of new processes.
• Knowledge of conventional wafer unit processes (lithography, deposition, etch, CMP, and wet process) and prior experience supporting device or process module development.
• Experience with in-room characterization techniques, including thin-film and device-level measurements (e.g., AFM, ellipsometry, 4-point probe, XRF, FIB, SEM, (S)TEM, etc.).
• Knowledge of standard statistical experimentation methods, including hypothesis testing, DOE design and analysis, and ANOVA.

You Might Also Have:

• Familiarity with JMP or R is preferred but not required.

The estimated base salary range for this position is $109,470.00 - $159,545.00. The individual salary is based on work location and additional factors, including job-related skills, experience, and relevant education or training.

Seagate offers comprehensive benefits to its eligible employees, including, but not limited to, eligibility to participate in a discretionary bonus program, medical, dental, vision, and life insurance, short- and long-term disability, 401(k), employee stock purchase plan, health savings account, dependent care, and healthcare spending accounts. Seagate also offers paid time off, including 12 holidays, flexible time off provided pursuant to Seagate policy, a minimum of 48 hours of paid sick leave, and 16 weeks of paid parental leave. The benefits for this position are based on a full-time schedule for a full calendar year and may differ depending on work location.

At Seagate our mission is to build the world’s best data storage devices.

The Advanced Transducer Development group is a global R&D organization that develops new recording head technologies to advance areal density and enable Seagate’s HDD (Hard Disk Drive) 4 year+ product roadmap. Our process team uses state-of-the-art wafer fabrication tools and cleanroom facilities to innovate and deliver leading-edge writers and read sensors. With an emphasis on proving feasibility of new devices, processes and materials, we help build Seagate’s future time-to-market leadership.

If you are excited by innovative technology development, are naturally creative, and passionate about seeing ideas come to life then this could be a perfect fit for your research and development career.