Thin Films Module Development Engineering

As a Module Development Engineer, you will play a crucial role in driving advancements in Intel’s semiconductor manufacturing technologies. You will focus on developing and optimizing advanced manufacturing processes to enable cutting-edge device architectures. Leveraging your expertise in process integration, equipment solutions, and feasibility studies, you will help shape Intel’s future technology roadmap while ensuring robust and scalable solutions for high-volume manufacturing. Your work will directly contribute to Intel’s innovation and leadership in the semiconductor industry., * Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.

• Drive technology development and enablement for both high-volume manufacturing and future technologies.
• Conduct feasibility studies and simulations to achieve desired device specifications.
• Develop and execute technology roadmaps to guide future manufacturing needs and set industry standards.
• Collaborate with equipment and material suppliers to design and implement innovative process technologies.
• Optimize production efficiency, manufacturing techniques, and output for existing and new products.
• Utilize statistical process control and data analytics to enhance process stability and drive continuous improvements.
• Recommend and implement modifications to operational equipment to improve efficiency and scalability.
• Partner with cross-functional teams to ensure alignment on process integration and project deliverables.

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates., * Bachelor’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 5+ years of relevant experience.

• OR Master’s degree in the same fields with 3+ years of relevant experience.
• OR PhD in the same fields with 1+ years of relevant experience.

Experience listed above should be a combination of the following:

• Proven expertise in manufacturing process development, statistical process control, and/or data analytics.
• Experience in wafer-level assembly, semiconductor processing, or advanced packaging technology development.
• Experience with films processing techniques such as CVD / PECVD , thermal/PE ALD and PVD., * Experience in wafer-level assembly, advanced packaging, or related technologies such as hybrid bonded interconnects.
• Demonstrated success in leading programs from strategy formation to high-volume production.
• Recognized technical leadership with a proven track record of solving complex engineering challenges.
• Strong collaboration skills across functional areas like yield, operations, and supplier management.