Principal Applications Engineer

DUTIES: As the Principal Applications Engineer, be the technical liaison between US development teams (Application Engineers, RF Design Engineers) and our organization’s application engineers abroad who are working in direct contact with end customers and technical partners. Coordinate the activities at both locations to maximize efficiency and shorten time-to-market of our organization’s Radio Frequency (RF) solutions. This includes working with a number of RF technologies, components, systems, products, and solutions. Additionally, will act as technical leader driving the voice of the customer: ensure customer critical features and specifications are accounted for in the solutions developed by US design teams. Highlight customer change requests and new feature requests early enough to US technical teams in order to maintain the relevance of the products in development. Publish internal documentation detailing new customers’ standards and new architecture choices. Drive changes in measurement methods to keep them aligned to the latest evolutions of RF communication standards. Moreover, responsibilities include mentoring and training junior Application Engineers, and Field Application Engineers on new products and new features. Standardize and document characterization techniques for measurement at the system level. Hybrid: Four days in the office with one day optional may work home.

MINIMUM REQUIREMENTS: Bachelor’s degree in Electrical Engineering or Electronic Engineering and 10 years of experience in the semiconductor, radio communication, or related fields. Also, 5 years of experience stated herein to involve: (1) RF equipment including, signal generators, network analyzers, spectrum analyzers, oscilloscopes, to perform testing and debugging of product evaluation boards and customer reference design boards; (2) RF circuit design, filter design, impedance matching, and PCB board schematic and layout tools; and (3) WiFi IEEE802.11 wireless communication standards and Digital Pre-distortion; (4) platform attachment, validate performance included RF, Throughput, Power consumption. Create design support package and training to support field applications engineers. Support package included datasheet, device revision guide, schematic, layout guide, hardware training guide, and design validation testing performance report; (5) Tier-1 customer support: Design review, RF

tuning, internal/external chipset features training, issues debug and root-cause analysis, performance (RF/Throughput/power consumption) improvement, regulatory certification, and mass production yield improvement; (6) perform QDART, QSPR, QRCT, QMINE (find the industry related tools); and (7) WiFi board data file (BDF) tuning on TPC/DPD parameters during RF tuning. Hybrid: Four days in the office with one day optional may work home.

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers’ most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.