VP / Director, Inductor Technology for AI / HPC

Destination 2D (D2D) is a nanotechnology equipment and process company commercializing intercalated multilayer graphene (MLG) for advanced electronics. Our patented CoolC platform grows wafer-scale, CMOS BEOL-compatible graphene at 300-400 C, and our intercalation doping process delivers resistivity and current-density characteristics beyond copper. Backed by a portfolio of 90+ patent filings and a leadership team drawn from Intel, NVIDIA, Samsung, TSMC, and Applied Materials - with a Nobel-laureate Chief Scientist - we are turning a breakthrough material into the building blocks of AI era hardware., As VP / Director, Inductor Technology, you will own D2D’s integrated-inductor product line from concept through customer qualification. You will set the technical direction, lead design and characterization, drive foundry and OSAT partnerships, and translate MLG’s material advantages into a manufacturable, design-win-ready component for AI/HPC power delivery. This is a rare opportunity to create a product category, not just iterate on one., * Product ownership: Define the integrated-inductor roadmap - target specifications (inductance density, Q, DCR, saturation current, profile), use cases, and the path from test vehicle to qualified product.

• Design & modeling: Lead electromagnetic and electro-thermal design of MLG-based inductors; oversee modeling, simulation, and design-of-experiments to optimize Q and current handling at on-package switching frequencies.
• Process integration: Work hand-in-hand with foundry partners to integrate MLG growth, patterning, and intercalation doping into a manufacturable flow; own the interface requirements (thermal budget, encapsulation, wafer handling).
• Characterization & reliability: Stand up RF/power characterization and reliability/thermal qualification against incumbent benchmarks; define success criteria and gating metrics for each program phase.
• Partnerships: Serve as technical lead in foundry, OSAT, and customer engagements; support joint development programs and translate customer power-delivery requirements into product specs.
• Team & IP: Build and mentor a small, high-leverage design/characterization team; contribute to the patent portfolio and protect D2D’s differentiation., You will define a product category at the intersection of the two biggest forces in semiconductors today - AI compute and the power-delivery wall - using a material no competitor can match, backed by a deep IP portfolio and a world-class team. The seat is open. We are looking for the person who will take it.

• BS/MS/PhD in Electrical Engineering, Applied Physics, Materials Science, or related field.
• 10+ years (Director) or 15+ years (VP) in passive component, power, or advanced-packaging development, with direct, hands-on experience designing inductors - integrated, thin-film, magnetic-core, or discrete power inductors.
• Deep understanding of inductor physics: Q factor, core loss, DCR, saturation, skin/proximity effects, and the design tradeoffs across frequency and current.
• Proven track record taking a passive component or power device from concept to qualification or high-volume production.
• Familiarity with power delivery for high-current, low-voltage loads - integrated voltage regulators, point-of-load conversion, or vertical power delivery.
• Experience working with semiconductor foundries and/or OSATs on process integration and qualification., * Experience with integrated passive devices (IPDs) or on-package/on-die power components for AI, HPC, or mobile SoCs.
• Working knowledge of advanced packaging (2.5D/3D, EMIB, CoWoS-class interposers, embedded-substrate passives).
• Exposure to novel conductor or magnetic materials and their integration into BEOL or packaging flows.
• Prior founding-team, startup, or 0-to-1 product experience., * 12-18 months: characterized baseline inductors demonstrating MLG’s advantage on at least one key axis, and a credible path to a qualified product.

Power delivery has become the binding constraint in AI and HPC. Accelerators now draw over 1,000 A at sub-1 V, pushing voltage conversion onto the package through integrated voltage regulators and vertical power delivery. Capacitors were the first passive to be solved; the integrated inductor is the harder, still-open problem - it must combine high Q, high current density, and a thin profile that no incumbent technology delivers at once.

D2D believes intercalated MLG can relieve several of these inductor constraints simultaneously - loss, current density, and thermal spreading. We are hiring a founding product leader to own this thesis end to end: to define, build, and bring to qualification a best-in-class integrated inductor, in partnership with leading foundry and packaging players.